Intel X5365 Design Guide - Page 40
Assembly Overview of the Intel Reference Thermal Mechanical Design
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Thermal/Mechanical Reference Design 2.4.4 2.4.4.1 2.4.4.2 Assembly Overview of the Intel Reference Thermal Mechanical Design The reference design heatsinks that meet the Quad-Core Intel® Xeon® Processor 5300 Series thermal performance targets are called the Common Enabling Kit (CEK) heatsinks, and are available in 1U, 2U, & 2U+ form factors. Each CEK consists of the following components: • Heatsink (with captive standoff and screws) • Thermal Interface Material (TIM) • CEK Spring Geometric Envelope The baseboard keepout zones on the primary and secondary sides and height restrictions under the enabling component region are shown in detail in Appendix B. The overall volumetric keep in zone encapsulates the processor, socket, and the entire thermal/mechanical enabling solution. Assembly Drawing Figure 2-16. Exploded View of CEK Thermal Solution Components 40 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)