Intel X5365 Design Guide - Page 53

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

53

Thermal/Mechanical Reference Design

2.4.8.2

Systems Considerations Associated with the Active CEK

This heatsink was designed to help pedestal chassis users to meet the processor

thermal requirements without the use of chassis ducting. It may be necessary to

implement some form of chassis air guide or air duct to meet the T

LA

temperature of

40

°

C depending on the pedestal chassis layout. Also, while the active heatsink solution

is designed to mechanically fit into a 2U chassis, it may require additional space at the

top of the heatsink to allow sufficient airflow into the heatsink fan. Therefore, additional

design criteria may need to be considered if this heatsink is used in a 2U rack mount

chassis, or in a chassis that has drive bay obstructions above the inlet to the fan

heatsink.

Thermal Profile A should be used to help determine the thermal performance of the

platform. The primary recommended control method for this solution is using pulse

width modulation control. This control method requires the motherboard provide the

correct PWM duty cycle to the active fan heatsink solution to properly follow the

thermal profile. If no PWM signal is detected the active heatsink solution will default

back to a thermistor controlled mode and the fan will automatically adjust fan RPM to

meet the thermal profile.

It is critical to supply a constant +12 V to the fan header so that the active CEK

heatsink solution can operate properly. If a system board has a jumper setting to select

either a constant +12 V power to the fan header or a variable voltage, it is strongly

recommended that the jumper be set by default to the constant +12 V setting.

It is recommended that the ambient air temperature outside of the chassis be kept at

or below 35

°

C. The air passing directly over the processor heatsink should not be

preheated by other system components. Meeting the processor’s temperature

specification is the responsibility of the system integrator.

2.4.8.3

Boxed Processor Contents

A direct chassis attach method must be used to avoid problems related to shock and

vibration, due to the weight of the heatsink required to cool the processor. The board

must not bend beyond specification in order to avoid damage. The boxed processor

contains the components necessary to solve both issues. The boxed processor will

include the following items:

•

Quad-Core Intel® Xeon® Processor 5300 Series

•

Unattached heatsink solution

•

4 screws, 4 springs, and 4 heatsink standoffs (all captive to the heatsink)

•

Thermal Interface Material (pre-applied on heatsink)

•

Installation Manual

•

Intel Inside

®

logo

Table 2-11.

Fan Cable Connector Pin Out (Active CEK)

Pin Number

Signal

Color

1

Ground (Constant)

Black

2

Power (+12V)

Yellow

3

Signal: 2 pulses per revolution

Green

4

Control 21KHz - 28KHz

Blue

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations	18
2.2 Processor Thermal Parameters and Features	18
2.2.1 Thermal Control Circuit and TDP	18
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	20
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series	26
2.2.8 Performance Targets	28
2.3 Characterizing Cooling Solution Performance Requirements	33
2.3.1 Fan Speed Control	33
2.3.2 Processor Thermal Characterization Parameter Relationships	35
2.3.3 Chassis Thermal Design Considerations	37
2.4 Thermal/Mechanical Reference Design Considerations	37
2.4.1 Heatsink Solutions	37
2.4.2 Thermal Interface Material	38
2.4.3 Summary	39
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	40
2.4.5 Thermal Solution Performance Characteristics	42
2.4.6 Thermal Profile Adherence	43
2.4.7 Components Overview	47
2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series	51
A 1U Alternative Heatsink Thermal/Mechanical Design	55
A.1 Component Overview	55
A.2 Thermal Solution Performance Characteristics	56
A.3 Thermal Profile Adherence	57
B Mechanical Drawings	59
C Heatsink Clip Load Methodology	85
C.1 Overview	85
C.2 Test Preparation	85
C.2.1 Heatsink Preparation	85
C.2.2 Typical Test Equipment	88
C.2.3 Test Procedure Examples	88
C.2.4 Time-Zero, Room Temperature Preload Measurement	88
C.2.5 Preload Degradation under Bake Conditions	89
D Safety Requirements	91
E Quality and Reliability Requirements	93
E.1 Intel Verification Criteria for the Reference Designs	93
E.1.1 Reference Heatsink Thermal Verification	93
E.1.2 Environmental Reliability Testing	93
E.1.3 Material and Recycling Requirements	95
F Enabled Suppliers Information	97
F.1 Supplier Information	97
F.1.1 Intel Enabled Suppliers	97

Intel X5365 Design Guide - Page 53

Systems Considerations Associated with the Active CEK, Boxed Processor Contents, Table 2-11.

Page 53 highlights