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Intel X5365 Design Guide - Page 89

C.2.5 Preload Degradation under Bake Conditions, Record continuous load cell data as follows

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Heatsink Clip Load Methodology C.2.5 4. Collect continuous load cell data at 1 Hz for the duration of the test. A minimum time to allow the load cell to settle is generally specified by the load cell vendors (often on the order of 3 minutes). The time zero reading should be taken at the end of this settling time. 5. Record the preload measurement (total from all three load cells) at the target time and average the values over 10 seconds around this target time as well, i.e. in the interval for example over [target time - 5 seconds; target time + 5 seconds]. Preload Degradation under Bake Conditions This section describes an example of testing for potential clip load degradation under bake conditions. 1. Preheat thermal chamber to target temperature (45 ºC or 85 ºC for example). 2. Repeat time-zero, room temperature preload measurement. 3. Place unit into preheated thermal chamber for specified time. 4. Record continuous load cell data as follows: Sample rate = 0.1 Hz for first 3 hrs Sample rate = 0.01 Hz for the remainder of the bake test 5. Remove assembly from thermal chamber and set into room temperature conditions 6. Record continuous load cell data for next 30 minutes at sample rate of 1 Hz. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 89

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations	18
2.2 Processor Thermal Parameters and Features	18
2.2.1 Thermal Control Circuit and TDP	18
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	20
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series	26
2.2.8 Performance Targets	28
2.3 Characterizing Cooling Solution Performance Requirements	33
2.3.1 Fan Speed Control	33
2.3.2 Processor Thermal Characterization Parameter Relationships	35
2.3.3 Chassis Thermal Design Considerations	37
2.4 Thermal/Mechanical Reference Design Considerations	37
2.4.1 Heatsink Solutions	37
2.4.2 Thermal Interface Material	38
2.4.3 Summary	39
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	40
2.4.5 Thermal Solution Performance Characteristics	42
2.4.6 Thermal Profile Adherence	43
2.4.7 Components Overview	47
2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series	51
A 1U Alternative Heatsink Thermal/Mechanical Design	55
A.1 Component Overview	55
A.2 Thermal Solution Performance Characteristics	56
A.3 Thermal Profile Adherence	57
B Mechanical Drawings	59
C Heatsink Clip Load Methodology	85
C.1 Overview	85
C.2 Test Preparation	85
C.2.1 Heatsink Preparation	85
C.2.2 Typical Test Equipment	88
C.2.3 Test Procedure Examples	88
C.2.4 Time-Zero, Room Temperature Preload Measurement	88
C.2.5 Preload Degradation under Bake Conditions	89
D Safety Requirements	91
E Quality and Reliability Requirements	93
E.1 Intel Verification Criteria for the Reference Designs	93
E.1.1 Reference Heatsink Thermal Verification	93
E.1.2 Environmental Reliability Testing	93
E.1.3 Material and Recycling Requirements	95
F Enabled Suppliers Information	97
F.1 Supplier Information	97
F.1.1 Intel Enabled Suppliers	97

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Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

Heatsink Clip Load Methodology

Collect continuous load cell data at 1 Hz for the duration of the test. A minimum

time to allow the load cell to settle is generally specified by the load cell vendors

(often on the order of 3 minutes). The time zero reading should be taken at the end

of this settling time.

Record the preload measurement (total from all three load cells) at the target time

and average the values over 10 seconds around this target time as well, i.e. in the

interval for example over [target time – 5 seconds; target time + 5 seconds].

C.2.5

Preload Degradation under Bake Conditions

This section describes an example of testing for potential clip load degradation under

bake conditions.

Preheat thermal chamber to target temperature (45 ºC or 85 ºC for example).

Repeat time-zero, room temperature preload measurement.

Place unit into preheated thermal chamber for specified time.

Record continuous load cell data as follows:

Sample rate = 0.1 Hz for first 3 hrs

Sample rate = 0.01 Hz for the remainder of the bake test

Remove assembly from thermal chamber and set into room temperature conditions

Record continuous load cell data for next 30 minutes at sample rate of 1 Hz.