Intel X5365 Design Guide - Page 48

Thermal/Mechanical Reference Design

48

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

Note:

Refer to

Appendix B

for more detailed mechanical drawings of the heatsink.

.

Note:

Refer to

Appendix B

for more detailed mechanical drawings of the heatsink.

The function of the standoffs is to provide a bridge between the chassis and the

heatsink for attaching and load carrying. When assembled, the heatsink is rigid against

the top of the standoff, and the standoff is rigid to a chassis standoff with the CEK

spring firmly sandwiched between the two. In dynamic loading situations the standoff

carries much of the heatsink load, especially in lateral conditions, when compared to

the amount of load transmitted to the processor package. As such, it is comprised of

steel. The distance from the bottom of the heatsink to the bottom of the standoff is

8.79 mm [0.346 in.] for a board thickness of 1.57 mm [0.062 in].

The standoff will

need to be modified for use in applications with a different board thickness, as defined

in

Section 2.4.4.2

.

The function of the screw is to provide a rigid attach method to sandwich the entire CEK

assembly together, activating the CEK spring under the baseboard, and thus providing

the TIM preload. A screw is an inexpensive, low profile solution that does not negatively

impact the thermal performance of the heatsink due to air blockage. Any fastener (i.e.

head configuration) can be used as long as it is of steel construction; the head does not

interfere with the heatsink fins, and is of the correct length of 20.64 mm [0.8125 in.].

Although the CEK heatsink fits into the legacy volumetric keep-in, it has a larger

footprint due to the elimination of retention mechanism and clips used in the older

enabled thermal/mechanical components. This allows the heatsink to grow its base and

Figure 2-23. Isometric View of the 2U+ CEK Heatsink

Figure 2-24. Isometric View of the 1U CEK Heatsink

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations	18
2.2 Processor Thermal Parameters and Features	18
2.2.1 Thermal Control Circuit and TDP	18
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	20
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series	26
2.2.8 Performance Targets	28
2.3 Characterizing Cooling Solution Performance Requirements	33
2.3.1 Fan Speed Control	33
2.3.2 Processor Thermal Characterization Parameter Relationships	35
2.3.3 Chassis Thermal Design Considerations	37
2.4 Thermal/Mechanical Reference Design Considerations	37
2.4.1 Heatsink Solutions	37
2.4.2 Thermal Interface Material	38
2.4.3 Summary	39
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	40
2.4.5 Thermal Solution Performance Characteristics	42
2.4.6 Thermal Profile Adherence	43
2.4.7 Components Overview	47
2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series	51
A 1U Alternative Heatsink Thermal/Mechanical Design	55
A.1 Component Overview	55
A.2 Thermal Solution Performance Characteristics	56
A.3 Thermal Profile Adherence	57
B Mechanical Drawings	59
C Heatsink Clip Load Methodology	85
C.1 Overview	85
C.2 Test Preparation	85
C.2.1 Heatsink Preparation	85
C.2.2 Typical Test Equipment	88
C.2.3 Test Procedure Examples	88
C.2.4 Time-Zero, Room Temperature Preload Measurement	88
C.2.5 Preload Degradation under Bake Conditions	89
D Safety Requirements	91
E Quality and Reliability Requirements	93
E.1 Intel Verification Criteria for the Reference Designs	93
E.1.1 Reference Heatsink Thermal Verification	93
E.1.2 Environmental Reliability Testing	93
E.1.3 Material and Recycling Requirements	95
F Enabled Suppliers Information	97
F.1 Supplier Information	97
F.1.1 Intel Enabled Suppliers	97

Intel X5365 Design Guide - Page 48

Isometric View of the 2U+ CEK Heatsink, the TIM preload. A screw is an inexpensive

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