Intel X5365 Design Guide - Page 95

Quality and Reliability Requirements E.1.2.4 E.1.3 Note: 3. No signs of physical damage on baseboard surface due to impact of heatsink. 4. No visible physical damage to the processor package. 5. Successful BIOS/Processor/memory test of post-test samples. 6. Thermal compliance testing to demonstrate that the case temperature specification can be met. Recommended BIOS/Processor/Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered. Testing setup should include the following components, properly assembled and/or connected: • Appropriate system baseboard. • Processor and memory. • All enabling components, including socket and thermal solution parts. The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Intel PC Diags is an example of software that can be utilized for this test. Material and Recycling Requirements Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (e.g. polyester and some polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-STD-810E, Method 508.4 must be performed to determine material performance. Material used shall not have deformation or degradation in a temperature life test. Any plastic component exceeding 25 grams should be recyclable per the European Blue Angel recycling standards. The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS compliant. Lead-free and Pb-free: Lead has not been intentionally added, but lead may still exist as an impurity below 1000 ppm. RoHS compliant: Lead and other materials banned in RoHS Directive are either (1) below all applicable substance thresholds as proposed by the EU or (2) an approved/pending exemption applies. RoHS implementation details are not fully defined and may change. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 95