Intel X5365 Design Guide - Page 33

Thermal/Mechanical Reference Design Table 2-6. Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series Parameter Maximum Unit Notes Altitude TLA TDP Sea-Level m 40 °C 50 W Heatsink designed at 0 meters 1U Reference Solution TCASE_MAX TCASE_MAX @ P_profile_min Airflow Pressure Drop ψCA 60 50 15 25.5 0.331 82.4 0.249 °C °C CFM m3 / hr Inches of H2O Pa °C/W P_profile_min = 22.2W. Airflow through the heatsink fins Mean + 3σ Note: In case of conflict, the processor Datasheet supersedes the information contained in the TMDG 2.3 Characterizing Cooling Solution Performance Requirements 2.3.1 Fan Speed Control Fan speed control (FSC) techniques to reduce system level acoustic noise are a common practice in server designs. The fan speed is one of the parameters that determine the amount of airflow provided to the thermal solution. Additionally, airflow is proportional to a thermal solution's performance, which consequently determines the TCASE of the processor at a given power level. Since the TCASE of a processor is an important parameter in the long-term reliability of a processor, the FSC implemented in a system directly correlates to the processor's ability to meet the Thermal Profile and hence the long-term reliability requirements. For this purpose, the parameter called TCONTROL as explained in Section 2.2.6, is to be used in FSC designs to ensure that the long-term reliability of the processor is met while keeping the system level acoustic noise down. Figure 2-14 depicts the relationship between TCONTROL and FSC methodology. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 33