Intel X5365 Design Guide - Page 47
Components Overview
UPC - 735858199292
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Thermal/Mechanical Reference Design Figure 2-22. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 60 TCASE_MAX @ TDP Thermal Profile Y=0.360*X+42 55 TCASE_MAX @P _PROFILE_MIN 50 Temperature ( C ) 45 1U CEK Reference Solution Y=0.249*X+40 Note: 2.4.7 2.4.7.1 40 0 5 10 15 20 25 30 P_ PROFILE_MIN 35 40 45 Power (W) 50 TDP Intel has also developed an 1U alternative reference heatsink design. This alternative heatsink design meets the thermal profile specifications of the Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series and offers the advantages of weight reduction and cost savings in using this alternative 1U heatsink. Refer to Appendix A for detailed information. Components Overview Heatsink with Captive Screws and Standoffs The CEK reference heatsink uses snapped-fin technology for its design. It consists of a copper base and copper fins with Shin-Etsu* G751 thermal grease as the TIM. The mounting screws and standoffs are also made captive to the heatsink base for ease of handling and assembly as shown in Figure 2-23 and Figure 2-24 for the 2U+ and 1U heatsinks, respectively. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 47