Intel X5365 Design Guide - Page 43
Thermal Profile Adherence, Equation 2-8.y = 0.190x + 40 - comparison
UPC - 735858199292
View all Intel X5365 manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 43 highlights
Thermal/Mechanical Reference Design Figure 2-18. 1U CEK Heatsink Thermal Performance 2.4.6 Thermal Profile Adherence The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile A for the Quad-Core Intel® Xeon® Processor X5300 Series. From Table 2-4, the threesigma (mean+3sigma) performance of the thermal solution is computed to be 0.190 °C/W and the processor local ambient temperature (TLA) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as: Equation 2-8.y = 0.190x + 40 where, y = Processor TCASE value (°C) x = Processor power value (W) Figure 2-19 below shows the comparison of this reference thermal solution's Thermal Profile to the Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A specification. The 2U+ CEK solution meets the Thermal Profile A with a 1.7 °C margin at the lower end (P_PROFILE_MIN) and 0.2 °C margin at the upper end (TDP). By designing to Thermal Profile A, it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 43