Intel X5365 Design Guide - Page 3

Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface (PECI 20 2.2.4 Multiple Core Special Considerations 21 2.2.5 Thermal Profile 24 2.2.6 TCONTROL Definition 25 2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series 26 2.2.8 Performance Targets 28 2.3 Characterizing Cooling Solution Performance Requirements 33 2.3.1 Fan Speed Control 33 2.3.2 Processor Thermal Characterization Parameter Relationships 35 2.3.3 Chassis Thermal Design Considerations 37 2.4 Thermal/Mechanical Reference Design Considerations 37 2.4.1 Heatsink Solutions 37 2.4.2 Thermal Interface Material 38 2.4.3 Summary 39 2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design........... 40 2.4.5 Thermal Solution Performance Characteristics 42 2.4.6 Thermal Profile Adherence 43 2.4.7 Components Overview 47 2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series 51 A 1U Alternative Heatsink Thermal/Mechanical Design 55 A.1 Component Overview 55 A.2 Thermal Solution Performance Characteristics 56 A.3 Thermal Profile Adherence 57 B Mechanical Drawings 59 C Heatsink Clip Load Methodology 85 C.1 Overview ...85 C.2 Test Preparation 85 C.2.1 Heatsink Preparation 85 C.2.2 Typical Test Equipment 88 C.2.3 Test Procedure Examples 88 C.2.4 Time-Zero, Room Temperature Preload Measurement 88 C.2.5 Preload Degradation under Bake Conditions 89 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 3