Intel X5365 Design Guide - Page 94

Quality and Reliability Requirements Table E-1. Use Conditions Environment Use Environment Speculative Stress Condition Shipping and Handling Shipping and Handling Mechanical Shock • System-level • Unpackaged • Trapezoidal • 25 g • velocity change is based on packaged weight Product Weight (lbs) Nonpalletized Product Velocity Change† (in/ sec) < 20 lbs 250 20 to > 40 225 40 to > 80 205 80 to < 100 175 100 to < 145 120 125 ≥120 †Change in velocity is based upon a 0.5 coefficient of restitution. Random Vibration • System Level • Unpackaged • 5 Hz to 500 Hz • 2.20 g RMS random • 5 Hz @ .001 g2/Hz to 20 Hz @ 0.01 g2/Hz (slope up) • 20 Hz to 500 Hz @ 0.01 g2/Hz (flat) • Random control limit tolerance is ± 3 dB Example Use Condition Example 7-Yr Stress Equiv. Example 10Yr Stress Equiv. Total of 12 n/a n/a drops per system: • 2 drops per axis • ± direction Total per n/a n/a system: • 10 minutes per axis • 3 axes Note: In the case of a discrepancy, information in the most recent LGA771 Socket Mechanical Design Guidelines supersedes that in the Table E-1 above. E.1.2.2 Recommended Test Sequence Each test sequence should start with components (i.e. baseboard, heatsink assembly, etc.) that have not been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/Processor/memory test. The stress test should be then followed by a visual inspection and then BIOS/Processor/memory test. E.1.2.3 Post-Test Pass Criteria The post-test pass criteria are: 1. No significant physical damage to the heatsink and retention hardware. 2. Heatsink remains seated and its bottom remains mated flatly against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware. 94 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)