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Guidelines For Lead Free Solder

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CHAPTER 4 DISASSEMBLY AND RE-ASSEMBLY 6. GUIDELINES FOR LEAD FREE SOLDER Information on Manually Repairing PCB Soldered with Lead-Free Solder This document provides information on how to correctly make manual repairs to a printed circuit board (PCB) soldered with lead-free solder. 1. Characteristics of lead-free solder Melting point higher than that of conventional tin-lead solder (Lead-free solder: approx. 220'C, Conventional tin-lead solder: approx. 180'C) Relatively poor solder wettability and spread (difficult to wet and spread), and hard Appearance (dull and grainy surface) different from that of conventional solder Relatively poor wettability, rough surface (bumps are likely to be formed), and solder dragging Poor solder elevation Poor thermal conductivity and heat resistant (difficult to melt) 2. Metal composition & wire solder The metal composition of lead-free solder allowed for use on PCBs for Brother's products is following. LF Compositon Manufacture Origin Name Indication r 1 Sn/Ag/Cu Nihon Genma H only Sn/Ag/Cu Nihon Component- Genma side Japan Japan DHB-RMA3 NP303 DHB-RMA3 NP303 We use wire solder which is indicated by digit after LF indication on PCB. Wire solder made in the contries except Japan are under investigation,and will be evaluated. 3. Appearance quality criteria The appearance of the surface of portions soldered with lead-free solder is basically the same as that for those soldered with conventional lead-tin solder, except for the following points. 1) The surface of a portion soldered with lead-free solder is dull and not smooth. 2) Shrinkage cracks can be observed on the surface of a portion soldered with lead-free solder. (They can be observed using a magnifying glass with approx. 10x magnification.) Shrinkage cracks Figure 1 Shrinkage Cracks 4. Identification of lead-free solder on PCBs For PCBs that use lead-free solder, "LF" is indicated by silk-screen printing or attaching a label. "LF" stands for lead free and indicates that the PCBs bearing such an indication have been soldered with lead-free solder. A digit is given in a box following "LF" if produced by silk-screen printing or follows "LF" without a box on an attached label, the digit indicating the metal composition and wire solder. 4-63

Section	Page
HL-5030/5040/5050/5070 Service Manual	1
PREFACE	3
TABLE OF CONTENTS	4
REGULATION	9
SAFETY INFORMATION	11
CHAPTER 1 GENERAL	13
1. FEATURES	13
2. OVERVIEW	15
3. SPECIFICATIONS	16
3.1 Printing	16
3.2 Functions	17
3.3 Electrical and Mechanical	18
3.4 Network	19
3.5 Paper	20
3.5.1 Feedable paper	20
3.5.2 Paper cassette capacity	22
3.5.3 Print delivery	22
3.6 Printable Area	24
3.6.1 PCL5e/EPSON/IBM emulation	24
3.6.2 PCL6/BR-Script3 emulation	27
3.7 Print Speeds with Various Settings	28
3.8 Toner Cartridge Weight Information	29
4. SERIAL NO. DESCRIPTIONS	30
CHAPTER 2 INSTALLATION AND BASIC OPERATION	32
1. CONDITIONS REQUIRED FOR INSTALLATION	32
1.1 Power Supply	32
1.2 Environment	32
1.3 System Requirements for Brother Printer Solution for Windows	33
2. UNPACKING	34
3. INSTALL THE PRINTER	35
3.1 For All Users	35
3.1.1 Install the drum unit assembly	36
3.1.2 Load paper into the paper tray	36
3.1.3 Print a test page	37
3.2 For Windows Users	38
3.3 For Macintosh Users	42
4. PRINTING METHODS	45
4.1 Printing from the Paper Tray	45
4.2 Printing from manual feed tray (HL-5030/5040 only)	45
4.3 Printing from Multi-purpose Tray (MP Tray) : HL-5050/5070N only	46
4.4 Printing on envelopes	48
4.5 Printing on transparencies	52
4.6 Printing on Both Sides of the Paper (manual duplex printing)	55
4.7 Guidelines for printing on both sides of the paper	57
4.8 Paper orientation for printing on both sides of the paper	58
5. CONTROL PANEL OPERATION	59
5.1 Control Panel Buttons & LED functions	59
5.1.1 LEDs	59
5.1.2 Control Panel Buttons	59
5.2 LED indications	60
5.3 Service call indications	62
5.4 Control Panel Button Operations	63
5.5 Other Control Features	64
5.5.1 Sleep mode	64
5.5.2 Print a test page	65
5.5.3 Printer Settings	65
5.5.4 Print fonts (For HL-5040, HL-5050, and HL-5070N)	66
6. NETWORK FUNCTIONS	67
6.1 LED functions	67
6.2 Network Factory default setting (For HL-5070N)	67
7. PAPER CASSETTE INFORMATION (FOR EUROPE ONLY)	68
CHAPTER 3 THEORY OF OPERATION	69
1. ELECTRONICS	69
1.1 General Block Diagram	69
1.2 Main PCB Block Diagram	70
1.3 Main PCB	71
1.3.1 CPU	71
1.3.2 USB	73
1.3.3 IEEE1284	74
1.3.4 Network Interface	75
1.3.5 ROM	76
1.3.6 Flash ROM	77
1.3.7 SDRAM	78
1.3.8 Optional RAM	79
1.3.9 EEPROM	81
1.3.10 Reset Circuit	81
1.3.11 Engine I/O	82
1.3.12 Panel I/O	82
1.3.13 Video I/O	83
1.3.14 Power Supply	84
1.4 Engine PCB	85
1.5 Power Supply	86
1.5.1 Low-voltage power supply	86
1.5.2 High-voltage power supply	87
2. MECHANICS	88
2.1 Overview of Printing Mechanism	88
2.2 Paper Transfer	89
2.2.1 Paper supply	89
2.2.2 Paper registration	89
2.2.3 Paper eject	90
2.3 Sensors	91
2.3.1 Cover sensors	91
2.3.2 Toner sensors	91
2.3.3 Cassette sensor / Paper empty sensor (HL-5040/5050/5070N)	92
2.3.4 Paper eject sensor	92
2.3.5 MP-PE sensor	93
2.4 Drum Unit	94
2.4.1 Photosensitive drum	94
2.4.2 Primary charger	94
2.4.3 Transfer roller	94
2.4.4 Cleaner	94
2.5 Toner Cartridge	94
2.6 Print Process	94
2.6.1 Charging	94
2.6.2 Exposure stage	95
2.6.3 Developing	96
2.6.4 Transfer	96
2.6.5 Fixing stage	97
CHAPTER 4 DISASSEMBLY AND RE-ASSEMBLY	98
1. SAFETY PRECAUTIONS	98
2. DISASSEMBLY FLOW	99
3. DISASSEMBLY PROCEDURE	100
3.1 AC Cord	100
3.2 Drum Unit	100
3.3 Paper Tray	101
3.4 Access Cover	111
3.5 Rear Cover C	111
3.6 Outer Chute (for HL-5030/5040 only)	112
3.7 Rear Cover MP ASSY / Outer Chute MP ASSY (for HL-5050/5070N only)	113
3.8 Rear Cover L/R	114
3.9 Side Cover L/R	115
3.10 Top Cover	116
3.11 Front Cover ASSY (for HL-5030/5040 only)	119
3.12 MP Unit (for HL-5050/5070N only)	120
3.13 Fixing Unit	126
3.14 Laser Unit	135
3.15 Main PCB	137
3.16 Base Plate / LV Insulation Sheet	139
3.17 Engine PCB	140
3.18 High-voltage PS PCB ASSY	141
3.19 Low-voltage PS PCB ASSY	142
3.20 Paper Feeder	143
3.21 Frame L / Drive Unit	151
3.22 Fan Motor 60 Unit LV / Fan Motor 60 Unit	155
3.23 Frame R	156
4. PACKING	158
5. LUBRICATION	159
6. GUIDELINES FOR LEAD FREE SOLDER	160
CHAPTER 5 PERIODIC MAINTENANCE	163
1. CONSUMABLE PARTS	163
1.1 Drum Unit	163
1.2 Toner Cartridge	165
2. PERIODICAL REPLACEMENT PARTS	170
2.1 Fixing Unit	171
2.2 Paper Feeding Kit	174
3. PERIODICAL CLEANING	176
3.1 Cleaning the Printer Exterior	176
3.2 Cleaning the Drum Unit	176
3.3 Cleaning the Scanner Window	177
3.4 Cleaning the Electrical Terminals	178
4. MTBF / MTTR	179
CHAPTER 6 TROUBLESHOOTING	180
1. INTRODUCTION	180
1.1 Initial Check	180
1.2 Warnings for Maintenance Work	181
1.3 Identify the Problem	182
2. OPERATOR CALLS & SERVICE CALLS	183
2.1 Operator Calls	183
2.2 Service Calls	184
3. ERROR MESSAGE	186
3.1 Error Message in the Status Monitor	186
3.2 Error Message Printouts	187
4. PAPER PROBLEMS	188
4.1 Paper Loading Problems	188
4.2 Paper Jams	189
4.2.1 Clearing jammed paper	189
4.2.2 Causes & countermeasures	193
4.3 Paper Feeding Problems	194
5. SOFTWARE SETTING PROBLEMS	196
6. MALFUNCTIONS	199
7. IMAGE DEFECTS	204
7.1 Image Defect Examples	204
7.2 Diameter of Rollers	204
7.3 Troubleshooting Image Defect	205
7.4 Location of Grounding Contacts	224
7.4.1 Drum unit	224
7.4.2 Printer body & Paper cassette	224
8. INCORRECT PRINTOUT	225
9. NETWORK PROBLEM	228
9.1 Installation Problem	228
9.2 Intermittent Problem	229
9.3 TCP/IP Troubleshooting	230
9.4 UNIX Troubleshooting	230
9.5 Windows NT/LAN Server (TCP/IP) Troubleshooting	231
9.6 Windows 95/98/Me (or later) Peer to Peer Print (LPR) Troubleshooting	231
9.7 Windows 95/98/Me (or later) Peer to Peer (HP JetAdmin Compatible Method) Troubleshooting	232
9.8 Windows 95/98/Me/NT 4.0 (or later) Peer to Peer Print (NetBIOS) Troubleshooting	232
9.9 Brother Internet Print (TCP/IP) Troubleshooting	232
9.10 Windows 95/98/Me/2000/XP IPP Troubleshooting	233
9.11 Novell Netware Troubleshooting	233
9.12 AppleTalk Troubleshooting	234
9.13 DLC/LLC Troubleshooting	234
9.14 Web Browser Troubleshooting (TCP/IP)	234
CHAPTER 7 SERVICE SUPPORT SOFTWARE	235
1. CONTROL PANEL	235
1.1 Test Print Mode	235
1.2 Service Mode	236
1.3 Inspection Mode	237
2. HOW TO KNOW DRUM UNIT LIFE & PAGE COUNTER	239
3. HOW TO USE THE SELF-DIAGNOSTICS TOOLS	242
4. NVRAM DEFAULT VALUE	246
5. HOW TO REWRITE HL-5030/5040/5050/5070N FLASH ROM	247
Appendix 1. Main PCB Circuit Diagram, HL-5030/5040/5050 (1/3)	252
Appendix 2. Main PCB Circuit Diagram, HL-5030/5040/5050 (2/3)	253
Appendix 3. Main PCB Circuit Diagram, HL-5030/5040/5050 (3/3)	254
Appendix 4. Main PCB Circuit Diagram, HL-5070N (1/4)	255
Appendix 5. Main PCB Circuit Diagram, HL-5070N (2/4)	256
Appendix 6. Main PCB Circuit Diagram, HL-5070N (3/4)	257
Appendix 7. Main PCB Circuit Diagram, HL-5070N (4/4)	258
Appendix 8. Point to Point Connection Diagram	259
Appendix 9. Engine PCB Circuit Diagram (1/2)	260
Appendix 10. Engine PCB Circuit Diagram (2/2)	261
Appendix 11. Low-voltage Power Supply PCB Circuit Diagram (120V)	262
Appendix 12. Low-voltage Power Supply PCB Circuit Diagram (230V)	263
Appendix 13. High-voltage Power Supply PCB Circuit Diagram	264

Match case Limit results 1 per page

CHAPTER 4 DISASSEMBLY AND RE-ASSEMBLY

4-6

GUIDELINES FOR LEAD FREE SOLDER

Information on Manually Repairing PCB Soldered with Lead-Free Solder

This document provides information on how to correctly make manual repairs to a printed circuit

board (PCB) soldered with lead-free solder.

1. Characteristics of lead-free solder

Melting point higher than that of conventional tin-lead solder

(Lead-free solder:

approx. 220'C, Conventional tin-lead solder:

approx. 180'C)

Relatively poor solder wettability and spread (difficult to wet and spread), and hard

Appearance (dull and grainy surface) different from that of conventional solder

Relatively poor wettability, rough surface (bumps are likely to be formed), and solder

dragging

Poor solder elevation

Poor thermal conductivity and heat resistant (difficult to melt)

2. Metal composition & wire solder

The metal composition of lead-free solder allowed for use on PCBs for Brother's products is

following.

Indication

Compositon

Manufacture

Origin

Name

Sn/Ag/Cu

Nihon

Genma

Japan

DHB-RMA3

NP303

only

Component-

side

Sn/Ag/Cu

Nihon

Genma

Japan

DHB-RMA3

NP303

We use wire solder which is indicated by digit after LF indication on PCB.

Wire solder made in the contries except Japan are under investigation,and will be evaluated.

3. Appearance quality criteria

The appearance of the surface of portions soldered with lead-free solder is basically the

same as that for those soldered with conventional lead-tin solder, except for the following

points.

The surface of a portion soldered with lead-free solder is dull and not smooth.

Shrinkage cracks can be observed on the surface of a portion soldered with lead-free

solder.

(They can be observed using a magnifying glass with approx. 10x

magnification.)

Shrinkage

cracks

Figure 1

Shrinkage Cracks

4. Identification of lead-free solder on PCBs

For PCBs that use lead-free solder, "LF" is indicated by silk-screen printing or attaching a

label.

"LF" stands for lead free and indicates that the PCBs bearing such an indication have

been soldered with lead-free solder.

A digit is given in a box

following "LF" if produced by

silk-screen printing or follows "LF" without a box on an attached label, the digit indicating the

metal composition and wire solder.