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CHAPTER 4 DISASSEMBLY AND RE-ASSEMBLY 7) A localized ventilation system and gloves are required for soldering operations. Lead-free solder does not contain the toxic substance lead, however, inhalation of the fumes may adversely affect the health of workers. The silver contained in leadfree solder is also a toxic substance, though it is not as toxic as lead, and, therefore, a localized ventilation system and gloves are required for lead-free solder soldering operations, as required for those with conventional solder. 6. Soldering irons When soldering is performed manually using lead-free solder, a soldering iron that has little reduction in its temperature needs to be used. This refers to a soldering iron that has a smaller degree of decrease in the temperature at the soldering iron's tip, such as when the soldering iron is applied to the base metal or solder is supplied, and the temperature is soon returned to the specified temperature. With soldering operations using lead-free solder, the requirement for the temperature of the soldering iron's tip is the same as that for conventional solder, however, the melting point of lead-free solder is higher than that of conventional solder so productivity will decrease with conventional soldering irons. Some tool manufacturers sell soldering irons designed for lead-free solder and that can maintain the productivity of the soldering operations. The soldering irons used at BIL are model no. 941 manufactured by HAKKO and M6SIC-40 manufactured by BONKOTE. The prices of these soldering irons for use with lead-free solder are three to four times higher than those for conventional soldering irons with a temperature controller built in. 7. No mixing of different solders When repairs are made on a PCB with an "LF" indication on it, leadfree solder with the same metal composition, which is expressed by the digit following "LF", must be used on a single PCB. For a PCB with an "LF" indication on it, neither tin-lead solder nor lead-free solder with a different metal composition must be used. Compatible solder for each countries are listed below. Solders are freely available from each manufacturer. Visit the web site below for more detail. Countries For Japan, UK, Finland, Germany, France, Sweden For World wide except Australia, New Zealand For Worldwide Manufacturer ALMIT KESTER AIM Origin JAPAN U.S.A. CANADA Name Web site KR-19 SH RMA http://www.almit.com LFM-48 KESTER245 KESTER285 http://www.kester.com CASTIN RMA2 http://www.aimsolder.co m 4-65

Section	Page
HL-5030/5040/5050/5070 Service Manual	1
PREFACE	3
TABLE OF CONTENTS	4
REGULATION	9
SAFETY INFORMATION	11
CHAPTER 1 GENERAL	13
1. FEATURES	13
2. OVERVIEW	15
3. SPECIFICATIONS	16
3.1 Printing	16
3.2 Functions	17
3.3 Electrical and Mechanical	18
3.4 Network	19
3.5 Paper	20
3.5.1 Feedable paper	20
3.5.2 Paper cassette capacity	22
3.5.3 Print delivery	22
3.6 Printable Area	24
3.6.1 PCL5e/EPSON/IBM emulation	24
3.6.2 PCL6/BR-Script3 emulation	27
3.7 Print Speeds with Various Settings	28
3.8 Toner Cartridge Weight Information	29
4. SERIAL NO. DESCRIPTIONS	30
CHAPTER 2 INSTALLATION AND BASIC OPERATION	32
1. CONDITIONS REQUIRED FOR INSTALLATION	32
1.1 Power Supply	32
1.2 Environment	32
1.3 System Requirements for Brother Printer Solution for Windows	33
2. UNPACKING	34
3. INSTALL THE PRINTER	35
3.1 For All Users	35
3.1.1 Install the drum unit assembly	36
3.1.2 Load paper into the paper tray	36
3.1.3 Print a test page	37
3.2 For Windows Users	38
3.3 For Macintosh Users	42
4. PRINTING METHODS	45
4.1 Printing from the Paper Tray	45
4.2 Printing from manual feed tray (HL-5030/5040 only)	45
4.3 Printing from Multi-purpose Tray (MP Tray) : HL-5050/5070N only	46
4.4 Printing on envelopes	48
4.5 Printing on transparencies	52
4.6 Printing on Both Sides of the Paper (manual duplex printing)	55
4.7 Guidelines for printing on both sides of the paper	57
4.8 Paper orientation for printing on both sides of the paper	58
5. CONTROL PANEL OPERATION	59
5.1 Control Panel Buttons & LED functions	59
5.1.1 LEDs	59
5.1.2 Control Panel Buttons	59
5.2 LED indications	60
5.3 Service call indications	62
5.4 Control Panel Button Operations	63
5.5 Other Control Features	64
5.5.1 Sleep mode	64
5.5.2 Print a test page	65
5.5.3 Printer Settings	65
5.5.4 Print fonts (For HL-5040, HL-5050, and HL-5070N)	66
6. NETWORK FUNCTIONS	67
6.1 LED functions	67
6.2 Network Factory default setting (For HL-5070N)	67
7. PAPER CASSETTE INFORMATION (FOR EUROPE ONLY)	68
CHAPTER 3 THEORY OF OPERATION	69
1. ELECTRONICS	69
1.1 General Block Diagram	69
1.2 Main PCB Block Diagram	70
1.3 Main PCB	71
1.3.1 CPU	71
1.3.2 USB	73
1.3.3 IEEE1284	74
1.3.4 Network Interface	75
1.3.5 ROM	76
1.3.6 Flash ROM	77
1.3.7 SDRAM	78
1.3.8 Optional RAM	79
1.3.9 EEPROM	81
1.3.10 Reset Circuit	81
1.3.11 Engine I/O	82
1.3.12 Panel I/O	82
1.3.13 Video I/O	83
1.3.14 Power Supply	84
1.4 Engine PCB	85
1.5 Power Supply	86
1.5.1 Low-voltage power supply	86
1.5.2 High-voltage power supply	87
2. MECHANICS	88
2.1 Overview of Printing Mechanism	88
2.2 Paper Transfer	89
2.2.1 Paper supply	89
2.2.2 Paper registration	89
2.2.3 Paper eject	90
2.3 Sensors	91
2.3.1 Cover sensors	91
2.3.2 Toner sensors	91
2.3.3 Cassette sensor / Paper empty sensor (HL-5040/5050/5070N)	92
2.3.4 Paper eject sensor	92
2.3.5 MP-PE sensor	93
2.4 Drum Unit	94
2.4.1 Photosensitive drum	94
2.4.2 Primary charger	94
2.4.3 Transfer roller	94
2.4.4 Cleaner	94
2.5 Toner Cartridge	94
2.6 Print Process	94
2.6.1 Charging	94
2.6.2 Exposure stage	95
2.6.3 Developing	96
2.6.4 Transfer	96
2.6.5 Fixing stage	97
CHAPTER 4 DISASSEMBLY AND RE-ASSEMBLY	98
1. SAFETY PRECAUTIONS	98
2. DISASSEMBLY FLOW	99
3. DISASSEMBLY PROCEDURE	100
3.1 AC Cord	100
3.2 Drum Unit	100
3.3 Paper Tray	101
3.4 Access Cover	111
3.5 Rear Cover C	111
3.6 Outer Chute (for HL-5030/5040 only)	112
3.7 Rear Cover MP ASSY / Outer Chute MP ASSY (for HL-5050/5070N only)	113
3.8 Rear Cover L/R	114
3.9 Side Cover L/R	115
3.10 Top Cover	116
3.11 Front Cover ASSY (for HL-5030/5040 only)	119
3.12 MP Unit (for HL-5050/5070N only)	120
3.13 Fixing Unit	126
3.14 Laser Unit	135
3.15 Main PCB	137
3.16 Base Plate / LV Insulation Sheet	139
3.17 Engine PCB	140
3.18 High-voltage PS PCB ASSY	141
3.19 Low-voltage PS PCB ASSY	142
3.20 Paper Feeder	143
3.21 Frame L / Drive Unit	151
3.22 Fan Motor 60 Unit LV / Fan Motor 60 Unit	155
3.23 Frame R	156
4. PACKING	158
5. LUBRICATION	159
6. GUIDELINES FOR LEAD FREE SOLDER	160
CHAPTER 5 PERIODIC MAINTENANCE	163
1. CONSUMABLE PARTS	163
1.1 Drum Unit	163
1.2 Toner Cartridge	165
2. PERIODICAL REPLACEMENT PARTS	170
2.1 Fixing Unit	171
2.2 Paper Feeding Kit	174
3. PERIODICAL CLEANING	176
3.1 Cleaning the Printer Exterior	176
3.2 Cleaning the Drum Unit	176
3.3 Cleaning the Scanner Window	177
3.4 Cleaning the Electrical Terminals	178
4. MTBF / MTTR	179
CHAPTER 6 TROUBLESHOOTING	180
1. INTRODUCTION	180
1.1 Initial Check	180
1.2 Warnings for Maintenance Work	181
1.3 Identify the Problem	182
2. OPERATOR CALLS & SERVICE CALLS	183
2.1 Operator Calls	183
2.2 Service Calls	184
3. ERROR MESSAGE	186
3.1 Error Message in the Status Monitor	186
3.2 Error Message Printouts	187
4. PAPER PROBLEMS	188
4.1 Paper Loading Problems	188
4.2 Paper Jams	189
4.2.1 Clearing jammed paper	189
4.2.2 Causes & countermeasures	193
4.3 Paper Feeding Problems	194
5. SOFTWARE SETTING PROBLEMS	196
6. MALFUNCTIONS	199
7. IMAGE DEFECTS	204
7.1 Image Defect Examples	204
7.2 Diameter of Rollers	204
7.3 Troubleshooting Image Defect	205
7.4 Location of Grounding Contacts	224
7.4.1 Drum unit	224
7.4.2 Printer body & Paper cassette	224
8. INCORRECT PRINTOUT	225
9. NETWORK PROBLEM	228
9.1 Installation Problem	228
9.2 Intermittent Problem	229
9.3 TCP/IP Troubleshooting	230
9.4 UNIX Troubleshooting	230
9.5 Windows NT/LAN Server (TCP/IP) Troubleshooting	231
9.6 Windows 95/98/Me (or later) Peer to Peer Print (LPR) Troubleshooting	231
9.7 Windows 95/98/Me (or later) Peer to Peer (HP JetAdmin Compatible Method) Troubleshooting	232
9.8 Windows 95/98/Me/NT 4.0 (or later) Peer to Peer Print (NetBIOS) Troubleshooting	232
9.9 Brother Internet Print (TCP/IP) Troubleshooting	232
9.10 Windows 95/98/Me/2000/XP IPP Troubleshooting	233
9.11 Novell Netware Troubleshooting	233
9.12 AppleTalk Troubleshooting	234
9.13 DLC/LLC Troubleshooting	234
9.14 Web Browser Troubleshooting (TCP/IP)	234
CHAPTER 7 SERVICE SUPPORT SOFTWARE	235
1. CONTROL PANEL	235
1.1 Test Print Mode	235
1.2 Service Mode	236
1.3 Inspection Mode	237
2. HOW TO KNOW DRUM UNIT LIFE & PAGE COUNTER	239
3. HOW TO USE THE SELF-DIAGNOSTICS TOOLS	242
4. NVRAM DEFAULT VALUE	246
5. HOW TO REWRITE HL-5030/5040/5050/5070N FLASH ROM	247
Appendix 1. Main PCB Circuit Diagram, HL-5030/5040/5050 (1/3)	252
Appendix 2. Main PCB Circuit Diagram, HL-5030/5040/5050 (2/3)	253
Appendix 3. Main PCB Circuit Diagram, HL-5030/5040/5050 (3/3)	254
Appendix 4. Main PCB Circuit Diagram, HL-5070N (1/4)	255
Appendix 5. Main PCB Circuit Diagram, HL-5070N (2/4)	256
Appendix 6. Main PCB Circuit Diagram, HL-5070N (3/4)	257
Appendix 7. Main PCB Circuit Diagram, HL-5070N (4/4)	258
Appendix 8. Point to Point Connection Diagram	259
Appendix 9. Engine PCB Circuit Diagram (1/2)	260
Appendix 10. Engine PCB Circuit Diagram (2/2)	261
Appendix 11. Low-voltage Power Supply PCB Circuit Diagram (120V)	262
Appendix 12. Low-voltage Power Supply PCB Circuit Diagram (230V)	263
Appendix 13. High-voltage Power Supply PCB Circuit Diagram	264

Match case Limit results 1 per page

CHAPTER 4 DISASSEMBLY AND RE-ASSEMBLY

4-6

A localized ventilation system and gloves are required for soldering operations.

Lead-free solder does not contain the toxic substance lead, however, inhalation of

the fumes may adversely affect the health of workers.

The silver contained in lead-

free solder is also a toxic substance, though it is not as toxic as lead, and, therefore,

a localized ventilation system and gloves are required for lead-free solder soldering

operations, as required for those with conventional solder.

6. Soldering irons

When soldering is performed manually using lead-free solder, a soldering iron that has

little reduction in its temperature needs to be used.

This refers to a soldering iron that

has a smaller degree of decrease in the temperature at the soldering iron's tip, such as

when the soldering iron is applied to the base metal or solder is supplied, and the

temperature is soon returned to the specified temperature.

With soldering operations using lead-free solder, the requirement for the temperature of

the soldering iron's tip is the same as that for conventional solder, however, the melting

point of lead-free solder is higher than that of conventional solder so productivity will

decrease with conventional soldering irons.

Some tool manufacturers sell soldering irons designed for lead-free solder and that can

maintain the productivity of the soldering operations.

The soldering irons used at BIL are model no. 941 manufactured by HAKKO and M6-

SIC-40 manufactured by BONKOTE.

The prices of these soldering irons for use with

lead-free solder are three to four times higher than those for conventional soldering irons

with a temperature controller built in.

7. No mixing of different solders

When repairs are made on a PCB with an "LF" indication on it, lead-

free solder with the same metal composition, which is expressed by

the digit following "LF", must be used on a single PCB.

For a PCB

with an "LF" indication on it, neither tin-lead solder nor lead-free solder

with a different metal composition must be used.

Compatible solder for each countries are listed below. Solders are freely available from each

manufacturer. Visit the web site below for more detail.

Countries

Manufacturer

Origin

Name

Web site

For Japan, UK,

Finland,

Germany,

France,

Sweden

ALMIT

JAPAN

KR-19 SH RMA

LFM-48

http://www.almit.com

For World wide

except

Australia, New

Zealand

KESTER

U.S.A.

KESTER245

KESTER285

http://www.kester.com

For Worldwide

AIM

CANADA

CASTIN RMA2

http://www.aimsolder.co