Acer Aspire 6530G Aspire 6530/6530G Quick Guide - Page 28

Hardware Specifications and Configurations

Page 28 highlights

Hardware Specifications and Configurations Processor Item CPU type CPU Features Power CPU package Specification AMD S1g2 Processor (Griffin Series-Turion/Sempron), T3(1.2~2.6G/s) (Bandwidth:9.6GB/s to 20.8GB/s) • Hyper Transport 3.0 Technology.Designed to support HT Gen 3 speed form 1.2Ghz to 2.6Ghz • 64-bit or 128-bit DDR2 Memory Interface, Two independent 64 Bit DDR2 channels • Split Power Planes, Separate power planes providesd for each CPU core and on die Northbridge • Up to 2 processor core per die, Upto 1MB L2 cache per die • Each CPU core supports up to 8 P-states: P0 (Highest performance) and P7 (Lowest) • VDD0,VDD1 set according to the respective P-stage control when core VDD are isolated and VDD set according to the CPU core in the highest performance P-state when VDD is common • CPU_VDDNB. VLDT 1.2V_HT, VDD I/O 1.8VSUS. CPU Memory Interface SMDDR_VTEM AMD 638-pin micro PGA CPU Fan True Value Table Level Fan On Temp. 1 50 2 60 3 70 4 80 Fan Off Temp. 45 55 65 75 RPM Throttling 2300 2600 2800 3100 dB(A) 31 34 37 40 • Throttling 50%: On =100°C ; Off=90°C • OS Shut down: 125C • H/W Shut down: 125C • Fan default: 5V Northbridge Item Specification Chipset AMD RS780MN Features • CPU Hyper Transport Interface , Support 16 bit up/down Hyper transport 3.0 interface up to 5.2GT/s • PCI Express Interface , Support PCIE GEN2 , Optimizes peer to peer and general purpose link performance, Highly flexible PCI Express implementation to suit a variety of platform needs Power 1.1V,1.2V, 1.8V, 3.3V Package FCBGA 528-pin 18 Chapter 1

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114
  • 115
  • 116
  • 117
  • 118
  • 119
  • 120
  • 121
  • 122
  • 123
  • 124
  • 125
  • 126
  • 127
  • 128
  • 129
  • 130
  • 131
  • 132
  • 133
  • 134
  • 135
  • 136
  • 137
  • 138
  • 139
  • 140
  • 141
  • 142
  • 143
  • 144
  • 145
  • 146
  • 147
  • 148
  • 149
  • 150
  • 151
  • 152
  • 153
  • 154
  • 155
  • 156
  • 157
  • 158
  • 159
  • 160
  • 161
  • 162
  • 163
  • 164
  • 165
  • 166
  • 167
  • 168
  • 169
  • 170
  • 171
  • 172
  • 173
  • 174
  • 175
  • 176
  • 177
  • 178
  • 179
  • 180
  • 181
  • 182
  • 183
  • 184
  • 185
  • 186
  • 187
  • 188
  • 189
  • 190
  • 191
  • 192
  • 193
  • 194
  • 195
  • 196
  • 197
  • 198
  • 199
  • 200
  • 201
  • 202
  • 203
  • 204
  • 205
  • 206
  • 207
  • 208
  • 209
  • 210
  • 211
  • 212
  • 213
  • 214
  • 215
  • 216
  • 217
  • 218
  • 219
  • 220
  • 221
  • 222
  • 223
  • 224

18
Chapter 1
Hardware Specifications and Configurations
Processor
CPU Fan True Value Table
Throttling 50%: On =100°C ; Off=90°C
OS Shut down: 125C
H/W Shut down: 125C
Fan default: 5V
Northbridge
Item
Specification
CPU type
AMD S1g2 Processor (Griffin Series-Turion/Sempron), T3(1.2~2.6G/s)
(Bandwidth:9.6GB/s to 20.8GB/s)
CPU Features
Hyper Transport 3.0 Technology.Designed to support HT Gen 3 speed form
1.2Ghz to 2.6Ghz
64-bit or 128-bit DDR2 Memory Interface, Two independent 64 Bit DDR2
channels
Split Power Planes, Separate power planes providesd for each CPU core and
on die Northbridge
Up to 2 processor core per die, Upto 1MB L2 cache per die
Each CPU core supports up to 8 P-states: P0 (Highest performance) and
P7 (Lowest)
Power
VDD0,VDD1 set according to the respective P-stage control when core VDD
are isolated and VDD set
according to the CPU core in the highest
performance
P-state when VDD is common
CPU_VDDNB. VLDT 1.2V_HT, VDD I/O 1.8VSUS. CPU Memory Interface
SMDDR_VTEM
CPU package
AMD 638-pin micro PGA
Level
Fan On Temp.
Fan Off Temp.
RPM Throttling
dB(A)
1
50
45
2300
31
2
60
55
2600
34
3
70
65
2800
37
4
80
75
3100
40
Item
Specification
Chipset
AMD RS780MN
Features
CPU Hyper Transport Interface , Support 16 bit up/down Hyper transport
3.0 interface up to 5.2GT/s
PCI Express Interface , Support PCIE GEN2 , Optimizes peer to peer and
general purpose link performance, Highly flexible PCI Express
implementation to suit a variety of platform needs
Power
1.1V,1.2V, 1.8V, 3.3V
Package
FCBGA 528-pin