HP Xw8400 HP xw8400 Service and Technical Reference Guide - Page 21

Environmental specifications, PCI card slot power specification, Table 1-12

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Environmental specifications This section describes environmental specifications of your workstation. Table 1-12 Environmental Specifications Temperature (operating) Temperature (non-operating) Humidity (operating) Humidity (non-operating) Altitude (operating) Altitude (non-operating) Shock (operating) Shock (non-operating) 40° to 95° F (5° to 35° C) -40° to 140° F (-40° to 60° C) 8% to 85% RH, non-condensing 8% to 90% RH, non-condensing 0 to 10,000 ft. (3,048 m) 0 to 30,000 ft. (9,144 m) 1/2-sine: 40 G, 2-3 ms 1/2-sine: 160 cm/s, 2-3 ms, (approximately 100 G) square: 605 cm/s, 30 G NOTE Values represent individual shock events and are not indicative of repetitive shock events. Vibration (operating) Vibration (non-operating) Operating random: 0.5 G (rms), 5-300 Hz Random: 2.0 G (rms), 10-500 Hz NOTE Values are not indicative of continuous vibration. PCI card slot power specification Table 1-13 PCI and PCI Express slot power specifications Slot# Slot Type Slot Power (Maximum) 1 PCI (32-bit, 33 MHz) 25 W* 2 PCI Express x16 graphics 150 W** 3 PCI Express x8 (x4) 25 W* 4 PCI Express x16 (x4) 25 W* 5 PCI-X 133 25 W* 6 PCI-X 100 25 W* 7 PCI-X 100 25 W* * In addition to these slot power specifications, the overall power consumption of the system (including I/O cards, processor, and memory) must not exceed the maximum ratings of the system power supply. See Power supply specifications on page 7 for details. ** Includes 75 W maximum from the system board connector, and 75 W maximum from the auxiliary graphics power connector. ENWW Product specifications 11

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Environmental specifications
This section describes environmental specifications of your workstation.
Table 1-12
Environmental Specifications
Temperature (operating)
40° to 95° F (5° to 35° C)
Temperature (non-operating)
–40° to 140° F (–40° to 60° C)
Humidity (operating)
8% to 85% RH, non-condensing
Humidity (non-operating)
8% to 90% RH, non-condensing
Altitude (operating)
0 to 10,000 ft. (3,048 m)
Altitude (non-operating)
0 to 30,000 ft. (9,144 m)
Shock (operating)
1/2-sine: 40 G, 2–3 ms
Shock (non-operating)
1/2-sine: 160 cm/s, 2–3 ms, (approximately 100 G)
square: 605 cm/s, 30 G
NOTE
Values represent individual shock events and
are not indicative of repetitive shock events.
Vibration (operating)
Operating random: 0.5 G (rms), 5–300 Hz
Vibration (non-operating)
Random: 2.0 G (rms), 10–500 Hz
NOTE
Values are not indicative of continuous
vibration.
PCI card slot power specification
Table 1-13
PCI and PCI Express slot power specifications
Slot#
Slot Type
Slot Power (Maximum)
1
PCI (32–bit, 33 MHz)
25 W*
2
PCI Express x16 graphics
150 W**
3
PCI Express x8 (x4)
25 W*
4
PCI Express x16 (x4)
25 W*
5
PCI-X 133
25 W*
6
PCI-X 100
25 W*
7
PCI-X 100
25 W*
* In addition to these slot power specifications, the overall power
consumption of the system (including I/O cards, processor, and
memory) must not exceed the maximum ratings of the system power
supply. See
Power supply specifications
on page
7
for details.
** Includes 75 W maximum from the system board connector, and
75 W maximum from the auxiliary graphics power connector.
ENWW
Product specifications
11