HP d248 HP Compaq Business Desktop d200 Series Personal Computers Service Refe - Page 46

Memory Modules

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Removal and Replacement Procedures- Microtower Type 2 Chassis 6.5 Memory Modules For more information on memory used in these computers refer to Appendix E. Ä CAUTION: The memory module sockets have gold metal contacts. When upgrading the memory, it is important to use memory modules with gold metal contacts to prevent corrosion and/or oxidation resulting from having incompatible metals in contact with each other. Ä CAUTION: Static electricity can damage the electronic components of the computer or optional cards. Before beginning these procedures, ensure that you are discharged of static electricity by briefly touching a grounded metal object. Refer to Chapter 5 for more information. Ä CAUTION: When handling a memory module, be careful not to touch any of the contacts. Doing so may damage the module. 1. Prepare the computer for disassembly (Section 6.1, "Preparation for Disassembly"). ✎ If there is a hard drive in bay 5 it will be necessary to remove the lower drive cage before removing the memory modules (Section 6.7.4, "Removing the Lower Drive Cage"). 2. Remove the right access panel (Section 6.2, "Access Panel"). Å WARNING: To reduce risk of personal injury from hot surfaces, allow the internal system components to cool before touching. 3. Lay the computer down on its side to make it easier to work on. 6-6 336493-004 Service Reference Guide, d200

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6–6
336493-004
Service Reference Guide, d200
Removal and Replacement Procedures— Microtower Type 2 Chassis
6.5 Memory Modules
For more information on memory used in these computers refer to
Appendix E
.
Ä
CAUTION:
The memory module sockets have gold metal contacts. When upgrading the memory, it is
important to use memory modules with gold metal contacts to prevent corrosion and/or oxidation
resulting from having incompatible metals in contact with each other.
Ä
CAUTION:
Static electricity can damage the electronic components of the computer or optional cards.
Before beginning these procedures, ensure that you are discharged of static electricity by briefly touching
a grounded metal object. Refer to Chapter 5 for more information.
Ä
CAUTION:
When handling a memory module, be careful not to touch any of the contacts. Doing so
may damage the module.
1. Prepare the computer for disassembly (
Section 6.1, “Preparation for Disassembly”
).
✎
If there is a hard drive in bay 5 it will be necessary to remove the lower drive cage before
removing the memory modules (
Section 6.7.4, “Removing the Lower Drive Cage”
).
2. Remove the right access panel (
Section 6.2, “Access Panel”
).
Å
WARNING:
To reduce risk of personal injury from hot surfaces, allow the internal system components to
cool before touching.
3. Lay the computer down on its side to make it easier to work on.