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Intel BX80605X3430 Data Sheet - Page 10

Intel, Processor 3400 Series Platform Diagram

UPC - 735858210331

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Introduction Figure 1-1. Intel® Xeon® Processor 3400 Series Platform Diagram Discrete Graphics (PEG) PCI Express* 1x16 OR PCI Express* 2 x 8 OR PCI Express* 4x4 Not e: Support ed PCI Express conf igurat ions vary by SKU. Quad Core CPU w it h Int egrat ed Memory Cont roller Processor DMI PECI Int el® Management Engine Intel®3 400 Series Chipset 2 Channels (2 UDIMM/ Channel) Or (3 RDIMM/ Channel) DDR3 DIMMs DDR3 DIMMs Serial ATA USB 2.0 6 Port s 3 Gb/ s 14 Port s SPI Flash PCI FWH TPM 1.2 Super I/ O SPI PCI LPC GPIO SMBUS 2 .0 PCI Express* 8 x1 PCI Express* 2.0 Port s (2.5 GT/ s) Intel®HD Audio Gigabit Network Connection Som e technologies m ay not be enabled on all processor SKUs. Refer to the Processor Specification Update for details. 10 Datasheet, Volume 1

Section	Page
1 Introduction	9
1.1 Processor Feature Details	11
1.1.1 Supported Technologies	11
1.2 Interfaces	11
1.2.1 System Memory Support	11
1.2.2 PCI Express*	12
1.2.3 Direct Media Interface (DMI)	13
1.2.4 Platform Environment Control Interface (PECI)	14
1.3 Power Management Support	14
1.3.1 Processor Core	14
1.3.2 System	14
1.3.3 Memory Controller	14
1.3.4 PCI Express*	14
1.4 Thermal Management Support	15
1.5 Package	15
1.6 Terminology	15
1.7 Related Documents	17
2 Interfaces	19
2.1 System Memory Interface	19
2.1.1 System Memory Technology Supported	19
2.1.2 System Memory Timing Support	21
2.1.3 System Memory Organization Modes	21
2.1.3.1 Single-Channel Mode	21
2.1.3.2 Dual-Channel Mode—Intel® Flex Memory Technology Mode	22
2.1.4 Rules for Populating Memory Slots	23
2.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA)	24
2.1.5.1 Just-in-Time Command Scheduling	24
2.1.5.2 Command Overlap	24
2.1.5.3 Out-of-Order Scheduling	24
2.1.6 System Memory Pre-Charge Power Down Support Details	24
2.2 PCI Express* Interface	25
2.2.1 PCI Express* Architecture	25
2.2.1.1 Transaction Layer	26
2.2.1.2 Data Link Layer	26
2.2.1.3 Physical Layer	26
2.2.2 PCI Express* Configuration Mechanism	27
2.2.3 PCI Express* Ports and Bifurcation	28
2.2.3.1 PCI Express* Bifurcated Mode	28
2.3 Direct Media Interface (DMI)	28
2.3.1 DMI Error Flow	28
2.3.2 Processor/PCH Compatibility Assumptions	28
2.3.3 DMI Link Down	28
2.4 Platform Environment Control Interface (PECI)	29
2.5 Interface Clocking	29
2.5.1 Internal Clocking Requirements	29
3 Technologies	31
3.1 Intel® Virtualization Technology	31
3.1.1 Intel® VT-x Objectives	31
3.1.2 Intel® VT-x Features	31
3.1.3 Intel® VT-d Objectives	32
3.1.4 Intel® VT-d Features	32
3.1.5 Intel® VT-d Features Not Supported	33
3.2 Intel® Trusted Execution Technology (Intel® TXT)	33
3.3 Intel® Hyper-Threading Technology	34
3.4 Intel® Turbo Boost Technology	34
4 Power Management	35
4.1 ACPI States Supported	35
4.1.1 System States	35
4.1.2 Processor Core/Package Idle States	35
4.1.3 Integrated Memory Controller States	35
4.1.4 PCI Express* Link States	36
4.1.5 Interface State Combinations	36
4.2 Processor Core Power Management	36
4.2.1 Enhanced Intel® SpeedStep® Technology	37
4.2.2 Low-Power Idle States	37
4.2.3 Requesting Low-Power Idle States	39
4.2.4 Core C-states	39
4.2.4.1 Core C0 State	40
4.2.4.2 Core C1/C1E State	40
4.2.4.3 Core C3 State	40
4.2.4.4 Core C6 State	40
4.2.4.5 C-State Auto-Demotion	40
4.2.5 Package C-States	41
4.2.5.1 Package C0	42
4.2.5.2 Package C1/C1E	42
4.2.5.3 Package C3 State	43
4.2.5.4 Package C6 State	43
4.3 IMC Power Management	43
4.3.1 Disabling Unused System Memory Outputs	43
4.3.2 DRAM Power Management and Initialization	44
4.3.2.1 Initialization Role of CKE	44
4.3.2.2 Conditional Self-Refresh	44
4.3.2.3 Dynamic Power Down Operation	44
4.3.2.4 DRAM I/O Power Management	45
4.4 PCI Express* Power Management	45
5 Thermal Management	47
6 Signal Description	49
6.1 System Memory Interface	50
6.2 Memory Reference and Compensation	52
6.3 Reset and Miscellaneous Signals	52
6.4 PCI Express* Based Interface Signals	53
6.5 DMI—Processor to PCH Serial Interface	53
6.6 PLL Signals	54
6.7 Intel® Flexible Display Interface Signals	54
6.8 JTAG/ITP Signals	55
6.9 Error and Thermal Protection	56
6.10 Power Sequencing	57
6.11 Processor Core Power Signals	57
6.12 Graphics and Memory Core Power Signals	59
6.13 Ground and NCTF	60
6.14 Processor Internal Pull Up/Pull Down	60
7 Electrical Specifications	61
7.1 Power and Ground Lands	61
7.2 Decoupling Guidelines	61
7.2.1 Voltage Rail Decoupling	61
7.3 Processor Clocking (BCLK[0], BCLK#[0])	62
7.3.1 PLL Power Supply	62
7.4 VCC Voltage Identification (VID)	62
7.5 Reserved or Unused Signals	66
7.6 Signal Groups	66
7.7 Test Access Port (TAP) Connection	69
7.8 Absolute Maximum and Minimum Ratings	69
7.9 DC Specifications	70
7.9.1 Voltage and Current Specifications	70
7.10 Platform Environmental Control Interface (PECI) DC Specifications	77
7.10.1 DC Characteristics	77
7.10.2 Input Device Hysteresis	78
8 Processor Land and Signal Information	79