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Intel BX80605X3430 Data Sheet - Page 15

Thermal Management Support, Package, Terminology - fan

UPC - 735858210331

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Introduction 1.4 1.5 1.6 Thermal Management Support • Digital Thermal Sensor • Intel® Adaptive Thermal Monitor • THERMTRIP# and PROCHOT# support • On-Demand Mode • Memory Thermal Throttling • External Thermal Sensor • Fan Speed Control with DTS Package • The processor socket type is noted as LGA 1156. The package is a 37.5 x 37.5 mm Flip Chip Land Grid Array (FCLGA 1156). Terminology Term Description DDR3 DP DMA DMI DTS ECC Enhanced Intel SpeedStep® Technology Execute Disable Bit FCLGA (G)MCH ICH IMC Intel® 64 Technology Intel® Hyper-Threading Technology Intel® Turbo Boost Technology Intel® TXT Third generation Double Data Rate SDRAM memory technology Display Port* Direct Memory Access Direct Media Interface Digital Thermal Sensor Error Correction Code Technology that provides power management capabilities. The Execute Disable bit allows memory to be marked as executable or nonexecutable, when combined with a supporting operating system. If code attempts to run in non-executable memory, the processor raises an error to the operating system. This feature can prevent some classes of viruses or worms that exploit buffer overrun vulnerabilities and can, thus, help improve the overall security of the system. See the Intel® 64 and IA-32 Architectures Software Developer's Manuals for more detailed information. Flip Chip Land Grid Array Legacy component - Graphics Memory Controller Hub. Platforms using LGA 1156 processors do not use a (G)MCH component. The legacy I/O Controller Hub component that contains the main PCI interface, LPC interface, USB2, Serial ATA, and other I/O functions. It communicates with the legacy (G)MCH over a proprietary interconnect called DMI. Platforms using LGA 1156 processors do not use an ICH component. Integrated Memory Controller 64-bit memory extensions to the IA-32 architecture. The processor supports Intel® Hyper-Threading Technology (Intel® HT Technology) that allows an execution core to function as two logical processors. Intel® Turbo Boost Technology is a feature that allows the processor core to opportunistically and automatically run faster than its rated operating frequency if it is operating below power, temperature, and current limits. Intel® Trusted Execution Technology Datasheet, Volume 1 15

Section	Page
1 Introduction	9
1.1 Processor Feature Details	11
1.1.1 Supported Technologies	11
1.2 Interfaces	11
1.2.1 System Memory Support	11
1.2.2 PCI Express*	12
1.2.3 Direct Media Interface (DMI)	13
1.2.4 Platform Environment Control Interface (PECI)	14
1.3 Power Management Support	14
1.3.1 Processor Core	14
1.3.2 System	14
1.3.3 Memory Controller	14
1.3.4 PCI Express*	14
1.4 Thermal Management Support	15
1.5 Package	15
1.6 Terminology	15
1.7 Related Documents	17
2 Interfaces	19
2.1 System Memory Interface	19
2.1.1 System Memory Technology Supported	19
2.1.2 System Memory Timing Support	21
2.1.3 System Memory Organization Modes	21
2.1.3.1 Single-Channel Mode	21
2.1.3.2 Dual-Channel Mode—Intel® Flex Memory Technology Mode	22
2.1.4 Rules for Populating Memory Slots	23
2.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA)	24
2.1.5.1 Just-in-Time Command Scheduling	24
2.1.5.2 Command Overlap	24
2.1.5.3 Out-of-Order Scheduling	24
2.1.6 System Memory Pre-Charge Power Down Support Details	24
2.2 PCI Express* Interface	25
2.2.1 PCI Express* Architecture	25
2.2.1.1 Transaction Layer	26
2.2.1.2 Data Link Layer	26
2.2.1.3 Physical Layer	26
2.2.2 PCI Express* Configuration Mechanism	27
2.2.3 PCI Express* Ports and Bifurcation	28
2.2.3.1 PCI Express* Bifurcated Mode	28
2.3 Direct Media Interface (DMI)	28
2.3.1 DMI Error Flow	28
2.3.2 Processor/PCH Compatibility Assumptions	28
2.3.3 DMI Link Down	28
2.4 Platform Environment Control Interface (PECI)	29
2.5 Interface Clocking	29
2.5.1 Internal Clocking Requirements	29
3 Technologies	31
3.1 Intel® Virtualization Technology	31
3.1.1 Intel® VT-x Objectives	31
3.1.2 Intel® VT-x Features	31
3.1.3 Intel® VT-d Objectives	32
3.1.4 Intel® VT-d Features	32
3.1.5 Intel® VT-d Features Not Supported	33
3.2 Intel® Trusted Execution Technology (Intel® TXT)	33
3.3 Intel® Hyper-Threading Technology	34
3.4 Intel® Turbo Boost Technology	34
4 Power Management	35
4.1 ACPI States Supported	35
4.1.1 System States	35
4.1.2 Processor Core/Package Idle States	35
4.1.3 Integrated Memory Controller States	35
4.1.4 PCI Express* Link States	36
4.1.5 Interface State Combinations	36
4.2 Processor Core Power Management	36
4.2.1 Enhanced Intel® SpeedStep® Technology	37
4.2.2 Low-Power Idle States	37
4.2.3 Requesting Low-Power Idle States	39
4.2.4 Core C-states	39
4.2.4.1 Core C0 State	40
4.2.4.2 Core C1/C1E State	40
4.2.4.3 Core C3 State	40
4.2.4.4 Core C6 State	40
4.2.4.5 C-State Auto-Demotion	40
4.2.5 Package C-States	41
4.2.5.1 Package C0	42
4.2.5.2 Package C1/C1E	42
4.2.5.3 Package C3 State	43
4.2.5.4 Package C6 State	43
4.3 IMC Power Management	43
4.3.1 Disabling Unused System Memory Outputs	43
4.3.2 DRAM Power Management and Initialization	44
4.3.2.1 Initialization Role of CKE	44
4.3.2.2 Conditional Self-Refresh	44
4.3.2.3 Dynamic Power Down Operation	44
4.3.2.4 DRAM I/O Power Management	45
4.4 PCI Express* Power Management	45
5 Thermal Management	47
6 Signal Description	49
6.1 System Memory Interface	50
6.2 Memory Reference and Compensation	52
6.3 Reset and Miscellaneous Signals	52
6.4 PCI Express* Based Interface Signals	53
6.5 DMI—Processor to PCH Serial Interface	53
6.6 PLL Signals	54
6.7 Intel® Flexible Display Interface Signals	54
6.8 JTAG/ITP Signals	55
6.9 Error and Thermal Protection	56
6.10 Power Sequencing	57
6.11 Processor Core Power Signals	57
6.12 Graphics and Memory Core Power Signals	59
6.13 Ground and NCTF	60
6.14 Processor Internal Pull Up/Pull Down	60
7 Electrical Specifications	61
7.1 Power and Ground Lands	61
7.2 Decoupling Guidelines	61
7.2.1 Voltage Rail Decoupling	61
7.3 Processor Clocking (BCLK[0], BCLK#[0])	62
7.3.1 PLL Power Supply	62
7.4 VCC Voltage Identification (VID)	62
7.5 Reserved or Unused Signals	66
7.6 Signal Groups	66
7.7 Test Access Port (TAP) Connection	69
7.8 Absolute Maximum and Minimum Ratings	69
7.9 DC Specifications	70
7.9.1 Voltage and Current Specifications	70
7.10 Platform Environmental Control Interface (PECI) DC Specifications	77
7.10.1 DC Characteristics	77
7.10.2 Input Device Hysteresis	78
8 Processor Land and Signal Information	79

Match case Limit results 1 per page

Datasheet, Volume 1

Introduction

1.4

Thermal Management Support

•

Digital Thermal Sensor

• Intel

Adaptive Thermal Monitor

•

THERMTRIP# and PROCHOT# support

•

On-Demand Mode

•

Memory Thermal Throttling

•

External Thermal Sensor

•

Fan Speed Control with DTS

1.5

Package

•

The processor socket type is noted as LGA 1156. The package is a 37.5 x 37.5 mm

Flip Chip Land Grid Array (FCLGA 1156).

1.6

Terminology

Term

Description

DDR3

Third generation Double Data Rate SDRAM memory technology

Display Port*

DMA

Direct Memory Access

DMI

Direct Media Interface

DTS

Digital Thermal Sensor

ECC

Error Correction Code

Enhanced Intel

SpeedStep

Technology

Technology that provides power management capabilities.

Execute Disable Bit

The Execute Disable bit allows memory to be marked as executable or non-

executable, when combined with a supporting operating system. If code attempts

to run in non-executable memory, the processor raises an error to the operating

system. This feature can prevent some classes of viruses or worms that exploit

buffer overrun vulnerabilities and can, thus, help improve the overall security of the

system. See the

Intel

64 and IA-32 Architectures Software Developer's Manuals

for more detailed information.

FCLGA

Flip Chip Land Grid Array

(G)MCH

Legacy component – Graphics Memory Controller Hub. Platforms using LGA 1156

processors do not use a (G)MCH component.

ICH

The legacy I/O Controller Hub component that contains the main PCI interface, LPC

interface, USB2, Serial ATA, and other I/O functions. It communicates with the

legacy (G)MCH over a proprietary interconnect called DMI. Platforms using LGA

1156 processors do not use an ICH component.

IMC

Integrated Memory Controller

Intel

64 Technology

64-bit memory extensions to the IA-32 architecture.

Intel

Hyper-Threading

Technology

The processor supports Intel

Hyper-Threading Technology (Intel

HT Technology)

that allows an execution core to function as two logical processors.

Intel

Turbo Boost

Technology

Intel

Turbo Boost Technology is a feature that allows the processor core to

opportunistically and automatically run faster than its rated operating frequency if it

is operating below power, temperature, and current limits.

Intel

TXT

Intel

Trusted Execution Technology