Intel BX80605X3430 Data Sheet - Page 4

Power Management, Thermal Management, Signal Description

Page 4 highlights

3.1.3 Intel® VT-d Objectives 32 3.1.4 Intel® VT-d Features 32 3.1.5 Intel® VT-d Features Not Supported 33 3.2 Intel® Trusted Execution Technology (Intel® TXT 33 3.3 Intel® Hyper-Threading Technology 34 3.4 Intel® Turbo Boost Technology 34 4 Power Management 35 4.1 ACPI States Supported 35 4.1.1 System States 35 4.1.2 Processor Core/Package Idle States 35 4.1.3 Integrated Memory Controller States 35 4.1.4 PCI Express* Link States 36 4.1.5 Interface State Combinations 36 4.2 Processor Core Power Management 36 4.2.1 Enhanced Intel® SpeedStep® Technology 37 4.2.2 Low-Power Idle States 37 4.2.3 Requesting Low-Power Idle States 39 4.2.4 Core C-states 39 4.2.4.1 4.2.4.2 4.2.4.3 4.2.4.4 4.2.4.5 Core C0 State 40 Core C1/C1E State 40 Core C3 State 40 Core C6 State 40 C-State Auto-Demotion 40 4.2.5 Package C-States 41 4.2.5.1 4.2.5.2 4.2.5.3 4.2.5.4 Package C0 42 Package C1/C1E 42 Package C3 State 43 Package C6 State 43 4.3 IMC Power Management 43 4.3.1 Disabling Unused System Memory Outputs 43 4.3.2 DRAM Power Management and Initialization 44 4.3.2.1 4.3.2.2 4.3.2.3 4.3.2.4 Initialization Role of CKE 44 Conditional Self-Refresh 44 Dynamic Power Down Operation 44 DRAM I/O Power Management 45 4.4 PCI Express* Power Management 45 5 Thermal Management 47 6 Signal Description ...49 6.1 System Memory Interface 50 6.2 Memory Reference and Compensation 52 6.3 Reset and Miscellaneous Signals 52 6.4 PCI Express* Based Interface Signals 53 6.5 DMI-Processor to PCH Serial Interface 53 6.6 PLL Signals ...54 6.7 Intel® Flexible Display Interface Signals 54 6.8 JTAG/ITP Signals 55 6.9 Error and Thermal Protection 56 6.10 Power Sequencing 57 6.11 Processor Core Power Signals 57 6.12 Graphics and Memory Core Power Signals 59 6.13 Ground and NCTF 60 6.14 Processor Internal Pull Up/Pull Down 60 4 Datasheet, Volume 1

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4
Datasheet, Volume 1
3.1.3
Intel
®
VT-d Objectives
............................................................................
32
3.1.4
Intel
®
VT-d Features
...............................................................................
32
3.1.5
Intel
®
VT-d Features Not Supported
..........................................................
33
3.2
Intel
®
Trusted Execution Technology (Intel
®
TXT)
.................................................
33
3.3
Intel
®
Hyper-Threading Technology
.....................................................................
34
3.4
Intel
®
Turbo Boost Technology
............................................................................
34
4
Power Management
.................................................................................................
35
4.1
ACPI States Supported
.......................................................................................
35
4.1.1
System States
........................................................................................
35
4.1.2
Processor Core/Package Idle States
...........................................................
35
4.1.3
Integrated Memory Controller States
.........................................................
35
4.1.4
PCI Express* Link States
.........................................................................
36
4.1.5
Interface State Combinations
...................................................................
36
4.2
Processor Core Power Management
......................................................................
36
4.2.1
Enhanced Intel
®
SpeedStep
®
Technology
..................................................
37
4.2.2
Low-Power Idle States
.............................................................................
37
4.2.3
Requesting Low-Power Idle States
............................................................
39
4.2.4
Core C-states
.........................................................................................
39
4.2.4.1
Core C0 State
...........................................................................
40
4.2.4.2
Core C1/C1E State
....................................................................
40
4.2.4.3
Core C3 State
...........................................................................
40
4.2.4.4
Core C6 State
...........................................................................
40
4.2.4.5
C-State Auto-Demotion
..............................................................
40
4.2.5
Package C-States
...................................................................................
41
4.2.5.1
Package C0
..............................................................................
42
4.2.5.2
Package C1/C1E
........................................................................
42
4.2.5.3
Package C3 State
......................................................................
43
4.2.5.4
Package C6 State
......................................................................
43
4.3
IMC Power Management
.....................................................................................
43
4.3.1
Disabling Unused System Memory Outputs
.................................................
43
4.3.2
DRAM Power Management and Initialization
...............................................
44
4.3.2.1
Initialization Role of CKE
............................................................
44
4.3.2.2
Conditional Self-Refresh
.............................................................
44
4.3.2.3
Dynamic Power Down Operation
..................................................
44
4.3.2.4
DRAM I/O Power Management
....................................................
45
4.4
PCI Express* Power Management
........................................................................
45
5
Thermal Management
..............................................................................................
47
6
Signal Description
....................................................................................................
49
6.1
System Memory Interface
...................................................................................
50
6.2
Memory Reference and Compensation
..................................................................
52
6.3
Reset and Miscellaneous Signals
..........................................................................
52
6.4
PCI Express* Based Interface Signals
...................................................................
53
6.5
DMI—Processor to PCH Serial Interface
.................................................................
53
6.6
PLL Signals
.......................................................................................................
54
6.7
Intel
®
Flexible Display Interface Signals
...............................................................
54
6.8
JTAG/ITP Signals
...............................................................................................
55
6.9
Error and Thermal Protection
...............................................................................
56
6.10
Power Sequencing
.............................................................................................
57
6.11
Processor Core Power Signals
..............................................................................
57
6.12
Graphics and Memory Core Power Signals
.............................................................
59
6.13
Ground and NCTF
..............................................................................................
60
6.14
Processor Internal Pull Up/Pull Down
....................................................................
60