Datasheet, Volume 1
3
Contents
1
Introduction
..............................................................................................................
9
1.1
Processor Feature Details
...................................................................................
11
1.1.1
Supported Technologies
..........................................................................
11
1.2
Interfaces
........................................................................................................
11
1.2.1
System Memory Support
.........................................................................
11
1.2.2
PCI Express*
.........................................................................................
12
1.2.3
Direct Media Interface (DMI)
....................................................................
13
1.2.4
Platform Environment Control Interface (PECI)
...........................................
14
1.3
Power Management Support
...............................................................................
14
1.3.1
Processor Core
.......................................................................................
14
1.3.2
System
.................................................................................................
14
1.3.3
Memory Controller
..................................................................................
14
1.3.4
PCI Express*
.........................................................................................
14
1.4
Thermal Management Support
............................................................................
15
1.5
Package
...........................................................................................................
15
1.6
Terminology
.....................................................................................................
15
1.7
Related Documents
...........................................................................................
17
2
Interfaces
................................................................................................................
19
2.1
System Memory Interface
..................................................................................
19
2.1.1
System Memory Technology Supported
.....................................................
19
2.1.2
System Memory Timing Support
...............................................................
21
2.1.3
System Memory Organization Modes
.........................................................
21
2.1.3.1
Single-Channel Mode
.................................................................
21
2.1.3.2
Dual-Channel Mode—Intel
®
Flex Memory Technology Mode
............
22
2.1.4
Rules for Populating Memory Slots
............................................................
23
2.1.5
Technology Enhancements of Intel
®
Fast Memory Access (Intel
®
FMA)
..........
24
2.1.5.1
Just-in-Time Command Scheduling
..............................................
24
2.1.5.2
Command Overlap
....................................................................
24
2.1.5.3
Out-of-Order Scheduling
............................................................
24
2.1.6
System Memory Pre-Charge Power Down Support Details
............................
24
2.2
PCI Express* Interface
.......................................................................................
25
2.2.1
PCI Express* Architecture
.......................................................................
25
2.2.1.1
Transaction Layer
.....................................................................
26
2.2.1.2
Data Link Layer
........................................................................
26
2.2.1.3
Physical Layer
..........................................................................
26
2.2.2
PCI Express* Configuration Mechanism
.....................................................
27
2.2.3
PCI Express* Ports and Bifurcation
...........................................................
28
2.2.3.1
PCI Express* Bifurcated Mode
....................................................
28
2.3
Direct Media Interface (DMI)
...............................................................................
28
2.3.1
DMI Error Flow
.......................................................................................
28
2.3.2
Processor/PCH Compatibility Assumptions
..................................................
28
2.3.3
DMI Link Down
......................................................................................
28
2.4
Platform Environment Control Interface (PECI)
......................................................
29
2.5
Interface Clocking
.............................................................................................
29
2.5.1
Internal Clocking Requirements
................................................................
29
3
Technologies
...........................................................................................................
31
3.1
Intel
®
Virtualization Technology
..........................................................................
31
3.1.1
Intel
®
VT-x Objectives
............................................................................
31
3.1.2
Intel
®
VT-x Features
..............................................................................
31