Intel P8700 Data Sheet - Page 101

Thermal Specifications and Design Considerations

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Thermal Specifications and Design Considerations 5 Thermal Specifications and Design Considerations A complete thermal solution includes both component and system-level thermal management features. To allow for the optimal operation and long-term reliability of Intel processor-based systems, the system/processor thermal solution should be designed so the processor remains within the minimum and maximum junction temperature (TJ) specifications at the corresponding thermal design power (TDP) value listed in the tables below Caution: Operating the processor outside these operating limits may result in permanent damage to the processor and potentially other components in the system. Table 20. Power Specifications for the Dual-Core Extreme Edition Processor Symbol Processor Number Core Frequency & Voltage TDP X9100 Symbol 3.06 GHz & VCCHFM 1.6 GHz & VCCLFM 0.8 GHz & VCCSLFM Parameter PAH, PSGNT PSLP PDSLP PDPRSLP PDC4 PC6 TJ Auto Halt, Stop Grant Power at VCCHFM at VCCSLFM Sleep Power at VCCHFM at VCCSLFM Deep Sleep Power at VCCHFM at VCCSLFM Deeper Sleep Power Intel® Enhanced Deeper Sleep state Power Intel® Deep Power Down Power Junction Temperature Thermal Design Power 44 29 20 Min Typ Max Unit W Unit Notes 1, 4, 5, 6 Notes - - 18.8 W 2, 5, 7 6.7 - - 17.8 W 2, 5, 7 6.4 - - 8.2 3.8 W 2, 5, 8 - - 1.9 W 2, 8 - - 1.7 W 2, 8 - - 1.3 W 2, 8 0 - 105 °C 3, 4 NOTES: 1. The TDP specification should be used to design the processor thermal solution. The TDP is not the maximum theoretical power the processor can generate. 2. Not 100% tested. These power specifications are determined by characterization of the processor currents at higher temperatures and extrapolating the values for the temperature indicated. 3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor's automatic mode is used to indicate that the maximum TJ has been reached. 4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within specifications. 5. Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser than TDP in HFM. 6. At Tj of 105 oC 7. At Tj of 50 oC 8. At Tj of 35 oC Datasheet 101

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Datasheet
101
Thermal Specifications and Design Considerations
5
Thermal Specifications and
Design Considerations
A complete thermal solution includes both component and system-level thermal
management features. To allow for the optimal operation and long-term reliability of
Intel processor-based systems, the system/processor thermal solution should be
designed so the processor remains within the minimum and maximum junction
temperature (T
J
) specifications at the corresponding thermal design power (TDP) value
listed in the tables below
Caution:
Operating the processor outside these operating limits may result in permanent
damage to the processor and potentially other components in the system.
NOTES:
1.
The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the maximum T
J
has been reached.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specifications.
5.
Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser
than TDP in HFM.
6.
At Tj of 105
o
C
7.
At Tj of 50
o
C
8.
At Tj of 35
o
C
Table 20.
Power Specifications for the Dual-Core Extreme Edition Processor
Symbol
Processor
Number
Core Frequency & Voltage
Thermal Design
Power
Unit
Notes
TDP
X9100
3.06 GHz & V
CCHFM
1.6 GHz & V
CCLFM
0.8 GHz & V
CCSLFM
44
29
20
W
1, 4,
5, 6
Symbol
Parameter
Min
Typ
Max
Unit
Notes
P
AH,
P
SGNT
Auto Halt, Stop Grant Power
at V
CCHFM
at V
CCSLFM
—
—
18.8
6.7
W
2, 5, 7
P
SLP
Sleep Power
at V
CCHFM
at V
CCSLFM
—
—
17.8
6.4
W
2, 5, 7
P
DSLP
Deep Sleep Power
at V
CCHFM
at V
CCSLFM
—
—
8.2
3.8
W
2, 5, 8
P
DPRSLP
Deeper Sleep Power
—
—
1.9
W
2, 8
P
DC4
Intel® Enhanced Deeper Sleep state Power
—
—
1.7
W
2, 8
P
C6
Intel® Deep Power Down Power
—
—
1.3
W
2, 8
T
J
Junction Temperature
0
—
105
°
C
3, 4