Intel P8700 Data Sheet - Page 105

Table 24., Power Specifications fro the Dual-Core Low Voltage LV SFF Processors, Symbol, Processor

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Thermal Specifications and Design Considerations Table 24. Power Specifications fro the Dual-Core Low Voltage (LV) SFF Processors Symbol TDP Processor Number SL9600 SL9400 SL9300 Core Frequency & Voltage 2.13 GHz & HFM VCC 1.86 GHz & HFM VCC 1.6 GHz & HFM VCC 1.6 GHz & Super LFM VCC 0.8 GHz & Super LFM VCC Symbol PAH, PSGNT PSLP PDSLP PDPRSLP PDC4 PC6 TJ Parameter Auto Halt, Stop Grant Power at VCCHFM at VCCSLFM Sleep Power at VCCHFM at VCCSLFM Deep Sleep Power at VCCHFM at VCCSLFM Deeper Sleep Power Intel® Enhanced Deeper Sleep State Power Intel® Deep Power Down Power Junction Temperature Thermal Design Power 17 17 17 16.7 10 Min Typ Max Unit W Unit Notes 1, 4, 5, 6 Notes - - 6.3 W 2, 5, 7 3.0 - - 5.7 W 2, 5, 7 2.8 - - 2.6 W 2, 5, 8 1.3 - - 0.9 W 2, 8 - - 0.8 W 2, 8 - - 0.3 W 2, 8 0 - 105 °C 3, 4 NOTES: 1. The TDP specification should be used to design the processor thermal solution. The TDP is not the maximum theoretical power the processor can generate. 2. Not 100% tested. These power specifications are determined by characterization of the processor currents at higher temperatures and extrapolating the values for the temperature indicated. 3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor's automatic mode is used to indicate that the maximum TJ has been reached. 4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within specifications. 5. Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser than TDP in HFM. 6. At Tj of 105 oC 7. At Tj of 50 °C 8. At Tj of 35 oC Datasheet 105

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Datasheet
105
Thermal Specifications and Design Considerations
NOTES:
1.
The TDP specification should be used to design the processor thermal solution. The TDP is not the
maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the processor currents
at higher temperatures and extrapolating the values for the temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic
mode is used to indicate that the maximum T
J
has been reached.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within
specifications.
5.
Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser than TDP in HFM.
6.
At Tj of 105
o
C
7.
At Tj of 50 °C
8.
At Tj of 35
o
C
Table 24.
Power Specifications fro the Dual-Core Low Voltage (LV) SFF Processors
Symbol
Processor
Number
Core Frequency & Voltage
Thermal Design
Power
Unit
Notes
TDP
SL9600
SL9400
SL9300
2.13 GHz & HFM V
CC
1.86 GHz & HFM V
CC
1.6 GHz & HFM V
CC
1.6 GHz & Super LFM V
CC
0.8 GHz & Super LFM V
CC
17
17
17
16.7
10
W
1, 4, 5,
6
Symbol
Parameter
Min
Typ
Max
Unit
Notes
P
AH,
P
SGNT
Auto Halt, Stop Grant Power
at V
CCHFM
at V
CCSLFM
—
—
6.3
3.0
W
2, 5, 7
P
SLP
Sleep Power
at V
CCHFM
at V
CCSLFM
—
—
5.7
2.8
W
2, 5, 7
P
DSLP
Deep Sleep Power
at V
CCHFM
at V
CCSLFM
—
—
2.6
1.3
W
2, 5, 8
P
DPRSLP
Deeper Sleep Power
—
—
0.9
W
2, 8
P
DC4
Intel® Enhanced Deeper Sleep State Power
—
—
0.8
W
2, 8
P
C6
Intel® Deep Power Down Power
—
—
0.3
W
2, 8
T
J
Junction Temperature
0
—
105
°
C
3, 4