Intel P8700 Data Sheet - Page 54
MB Die Micro-FCPGA Processor Package Drawing Sheet 2 of 2
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Package Mechanical Specifications and Pin Information Figure 11. 3-MB Die Micro-FCPGA Processor Package Drawing (Sheet 2 of 2) 54 4X 7.00 4X 7.00 ø0.305±0.25 ø0.406 M C A B ø0.254 M C 13.97 6.985 1.625 1.625 13.97 6.985 EDGE KEEP OUT ZONE 4X CORNER KEEP OUT ZONE 4X TOP VIEW 4X 5.00 SIDE VIEW 1.5 MAX ALLOWABLE COMPONENT HEIGHT BOTTOM VIEW Datasheet B6740-01 D76564(2)
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Package Mechanical Specifications and Pin Information
54
Datasheet
Figure 11.
3-MB Die Micro-FCPGA Processor Package Drawing (Sheet 2 of 2)
B6740-01
D76564(2)
TOP VIEW
SIDE VIEW
BOTTOM VIEW
CORNER
KEEP
OUT
ZONE
4X
EDGE
KEEP
OUT
ZONE
4X
4X
7.00
4X 5.00
4X
7.00
13.97
6.985
13.97
6.985
1.625
1.5
MAX
ALLOWABLE
COMPONENT
HEIGHT
1.625
ø
0.406
C
C
A
M
B
ø
0.254
ø
0.305±0.25
M