Intel P8700 Data Sheet - Page 48

Table 13., AGTL+ Signal Group DC Specifications, ODT/A, ODT/Cntrl - driver

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Electrical Specifications Table 13. AGTL+ Signal Group DC Specifications Symbol Parameter Min VCCP GTLREF RCOMP RODT/A RODT/D RODT/Cntrl VIH VIL VOH RTT/A RTT/D RTT/Cntrl RON/A RON/D RON/Cntrl ILI Cpad I/O Voltage Reference Voltage Compensation Resistor Termination Resistor Address Termination Resistor Data Termination Resistor Control Input High Voltage Input Low Voltage Output High Voltage Termination Resistance Address Termination Resistance Data Termination Resistance Control Buffer On Resistance Address Buffer On Resistance Data Buffer On Resistance Control Input Leakage Current Pad Capacitance 1.00 0.65 27.23 49 49 49 0.82 -0.10 0.90 50 50 50 23 23 23 - 1.80 Typ 1.05 0.70 27.5 55 55 55 1.05 0 VCCP 55 55 55 25 25 25 - 2.30 Max 1.10 0.72 27.78 63 63 63 1.20 0.55 1.10 61 61 61 29 29 29 ± 100 2.75 Unit V V V V V A pF Notes1 6 10 11, 12 11, 13 11, 14 3,6 2,4 6 7, 12 7, 13 7, 14 5, 12 5, 13 5, 14 8 9 NOTES: 1. Unless otherwise noted, all specifications in this table apply to all processor frequencies. 2. VIL is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low value. 3. VIH is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high value. 4. VIH and VOH may experience excursions above VCCP. However, input signal drivers must comply with the signal quality specifications. 5. This is the pulldown driver resistance. Measured at 0.31*VCCP. RON (min) = 0.418*RTT, RON (typ) = 0.455*RTT, RON (max) = 0.527*RTT. RTT typical value of 55 Ω is used for RON typ/min/max calculations. 6. GTLREF should be generated from VCCP with a 1% tolerance resistor divider. The VCCP referred to in these specifications is the instantaneous VCCP. 7. RTT is the on-die termination resistance measured at VOL of the AGTL+ output driver. Measured at 0.31*VCCP. RTT is connected to VCCP on die. Refer to processor I/O buffer models for I/V characteristics. 8. Specified with on-die RTT and RON turned off. Vin between 0 and VCCP. 9. Cpad includes die capacitance only. No package parasitics are included. 10. This is the external resistor on the comp pins. 11. On-die termination resistance, measured at 0.33*VCCP. 12. Applies to Signals A[35:3]. 13. Applies to Signals D[63:0]. 14. Applies to Signals BPRI#, DEFER#, PREQ#, PREST#, RS[2:0]#, TRDY#, ADS#, BNR#, BPM[3:0], BR0#, DBSY#, DRDY#, HIT#, HITM#, LOCK#, PRDY#, DPWR#, DSTB[1:0]#, DSTBP[3:0] and DSTBN[3:0]#. 48 Datasheet

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Electrical Specifications
48
Datasheet
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
V
IL
is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low
value.
3.
V
IH
is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high
value.
4.
V
IH
and V
OH
may experience excursions above V
CCP
. However, input signal drivers must comply with the
signal quality specifications.
5.
This is the pulldown driver resistance. Measured at 0.31*V
CCP
. R
ON
(min) = 0.418*R
TT
, R
ON
(typ) =
0.455*R
TT
,
R
ON
(max) = 0.527*R
TT
. R
TT
typical value of 55
Ω
is used for R
ON
typ/min/max calculations.
6.
GTLREF should be generated from V
CCP
with a 1% tolerance resistor divider. The V
CCP
referred to in these
specifications is the instantaneous V
CCP
.
7.
R
TT
is the on-die termination resistance measured at V
OL
of the AGTL+ output driver. Measured at
0.31*V
CCP
. R
TT
is connected to V
CCP
on die. Refer to processor I/O buffer models for I/V characteristics.
8.
Specified with on-die R
TT
and R
ON
turned off. Vin between 0 and V
CCP
.
9.
Cpad includes die capacitance only. No package parasitics are included.
10.
This is the external resistor on the comp pins.
11.
On-die termination resistance, measured at 0.33*V
CCP
.
12.
Applies to Signals A[35:3].
13.
Applies to Signals D[63:0].
14.
Applies to Signals BPRI#, DEFER#, PREQ#, PREST#, RS[2:0]#, TRDY#, ADS#, BNR#, BPM[3:0], BR0#,
DBSY#, DRDY#, HIT#, HITM#, LOCK#, PRDY#, DPWR#, DSTB[1:0]#, DSTBP[3:0] and DSTBN[3:0]#.
Table 13.
AGTL+ Signal Group DC Specifications
Symbol
Parameter
Min
Typ
Max
Unit
Notes
1
V
CCP
I/O Voltage
1.00
1.05
1.10
V
GTLREF
Reference Voltage
0.65
0.70
0.72
V
6
R
COMP
Compensation Resistor
27.23
27.5
27.78
Ω
10
R
ODT/A
Termination Resistor Address
49
55
63
Ω
11, 12
R
ODT/D
Termination Resistor Data
49
55
63
Ω
11, 13
R
ODT/Cntrl
Termination Resistor Control
49
55
63
Ω
11, 14
V
IH
Input High Voltage
0.82
1.05
1.20
V
3,6
V
IL
Input Low Voltage
-0.10
0
0.55
V
2,4
V
OH
Output High Voltage
0.90
V
CCP
1.10
V
6
R
TT/A
Termination Resistance Address
50
55
61
Ω
7, 12
R
TT/D
Termination Resistance Data
50
55
61
Ω
7, 13
R
TT/Cntrl
Termination Resistance Control
50
55
61
Ω
7, 14
R
ON/A
Buffer On Resistance Address
23
25
29
Ω
5, 12
R
ON/D
Buffer On Resistance Data
23
25
29
Ω
5, 13
R
ON/Cntrl
Buffer On Resistance Control
23
25
29
Ω
5, 14
I
LI
Input Leakage Current
—
—
± 100
μA
8
Cpad
Pad Capacitance
1.80
2.30
2.75
pF
9