Intel P8700 Data Sheet - Page 103

Datasheet

103

Thermal Specifications and Design Considerations

NOTES:

1.

The TDP specification should be used to design the processor thermal solution. The TDP is

not the maximum theoretical power the processor can generate.

2.

Not 100% tested. These power specifications are determined by characterization of the

processor currents at higher temperatures and extrapolating the values for the

temperature indicated.

3.

As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal

Monitor’s automatic mode is used to indicate that the maximum T

J

has been reached.

Refer to

Section 6.1

for more details.

4.

The Intel Thermal Monitor automatic mode must be enabled for the processor to operate

within specifications.

5.

Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser

than TDP in HFM.

6.

At Tj of 105

o

C

7.

At Tj of 50

o

C

8.

At Tj of 35

o

C

Table 22.

Power Specifications for the Dual-Core Low Power Standard Voltage

Processors (25W) in Standard Package

Symbol

Processor

Number

Core Frequency & Voltage

Thermal Design

Power

Unit

Notes

TDP

P9700

P9600

P8800

P9500

P8700

P8600

P8400

2.8 GHz & V

CCHFM

2.667 GHz & V

CCHFM

2.667 GHz & V

CCHFM

2.53 GHz & V

CCHFM

2.53 GHz & V

CCHFM

2.4 GHz & V

CCHFM

2.267 GHz & V

CCHFM

1.6 GHz & V

CCLFM

0.8 GHz & V

CCSLFM

25

25

25

25

25

25

25

20

11

W

1, 4,

5, 6

Symbol

Parameter

Min

Typ

Max

Unit

Notes

P

AH,

P

SGNT

Auto Halt, Stop Grant Power

at V

CCHFM

at V

CCSLFM

—

—

8.1

3.7

W

2, 5, 7

P

SLP

Sleep Power

at V

CCHFM

at V

CCSLFM

—

—

7.3

3.5

W

2, 5, 7

P

DSLP

Deep Sleep Power

at V

CCHFM

at V

CCSLFM

—

—

2.9

2.1

W

2, 5, 8

P

DPRSLP

Deeper Sleep Power

—

—

1.0

W

2, 8

P

DC4

Intel® Enhanced Deeper Sleep State Power

—

—

0.9

W

2, 8

P

C6

Intel® Deep Power Down Power

—

—

0.3

W

2, 8

T

J

Junction Temperature

0

—

105

°

C

3, 4

Section	Page
Intel® Core™2 Duo Mobile Processor, Intel® Core™2 Solo Mobile Processor and Intel® Core™2 Extreme Mobile Processor on 45-nm Process	1
Revision History	6
1 Introduction	7
1.1 Terminology	8
1.2 References	9
2 Low Power Features	11
2.1 Clock Control and Low-Power States	11
2.1.1 Core Low-Power State Descriptions	13
2.1.2 Package Low-power State Descriptions	15
2.2 Enhanced Intel SpeedStep® Technology	19
2.3 Extended Low-Power States	20
2.4 FSB Low Power Enhancements	21
2.4.1 Dynamic FSB Frequency Switching	21
2.4.2 Enhanced Intel® Dynamic Acceleration Technology	22
2.5 VID-x	23
2.6 Processor Power Status Indicator (PSI-2) Signal	23
3 Electrical Specifications	25
3.1 Power and Ground Pins	25
3.2 Decoupling Guidelines	25
3.2.1 VCC Decoupling	25
3.2.2 FSB AGTL+ Decoupling	25
3.2.3 FSB Clock (BCLK[1:0]) and Processor Clocking	25
3.3 Voltage Identification and Power Sequencing	26
3.4 Catastrophic Thermal Protection	29
3.5 Reserved and Unused Pins	29
3.6 FSB Frequency Select Signals (BSEL[2:0])	29
3.7 FSB Signal Groups	30
3.8 CMOS Signals	31
3.9 Maximum Ratings	31
3.10 Processor DC Specifications	32
4 Package Mechanical Specifications and Pin Information	51
4.1 Package Mechanical Specifications	51
4.2 Processor Pinout and Pin List	59
4.3 Alphabetical Signals Reference	93
5 Thermal Specifications and Design Considerations	101
5.1 Monitoring Die Temperature	108
5.1.1 Thermal Diode	108
5.1.2 Intel® Thermal Monitor	109
5.1.3 Digital Thermal Sensor	111
5.2 Out of Specification Detection	112

Intel P8700 Data Sheet - Page 103

Table 22., Power Specifications for the Dual-Core Low Power Standard Voltage

Page 103 highlights