Intel P8700 Data Sheet - Page 25

Electrical Specifications, 3.1 Power and Ground Pins, 3.2 Decoupling Guidelines - socket

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Electrical Specifications 3 Electrical Specifications 3.1 3.2 3.2.1 3.2.2 3.2.3 Power and Ground Pins For clean, on-chip power distribution, the processor will have a large number of VCC (power) and VSS (ground) inputs. All power pins must be connected to VCC power planes while all VSS pins must be connected to system ground planes. Use of multiple power and ground planes is recommended to reduce I*R drop. The processor VCC pins must be supplied the voltage determined by the VID (Voltage ID) pins. Decoupling Guidelines Due to its large number of transistors and high internal clock speeds, the processor is capable of generating large average current swings between low and full power states. This may cause voltages on power planes to sag below their minimum values if bulk decoupling is not adequate. Larger bulk storage, such as electrolytic capacitors, supply current during longer lasting changes in current demand by the component, such as coming out of an idle condition. Similarly, they act as a storage well for current when entering an idle condition from a running condition. Care must be taken in the board design to ensure that the voltage provided to the processor remains within the specifications listed in the tables in Section 3.10. Failure to do so can result in timing violations or reduced lifetime of the component. VCC Decoupling VCC regulator solutions need to provide bulk capacitance with a low Effective Series Resistance (ESR) and keep a low interconnect resistance from the regulator to the socket. Bulk decoupling for the large current swings when the part is powering on, or entering/exiting low-power states, should be provided by the voltage regulator solution depending on the specific system design. FSB AGTL+ Decoupling The processors integrate signal termination on the die as well as incorporate high frequency decoupling capacitance on the processor package. Decoupling must also be provided by the system motherboard for proper AGTL+ bus operation. FSB Clock (BCLK[1:0]) and Processor Clocking BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the processor. As in previous-generation processors, the processor core frequency is a multiple of the BCLK[1:0] frequency. The processor bus ratio multiplier will be set at its default ratio at manufacturing. The processor uses a differential clocking implementation. Datasheet 25

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Datasheet
25
Electrical Specifications
3
Electrical Specifications
3.1
Power and Ground Pins
For clean, on-chip power distribution, the processor will have a large number of V
CC
(power) and V
SS
(ground) inputs. All power pins must be connected to V
CC
power
planes while all V
SS
pins must be connected to system ground planes. Use of multiple
power and ground planes is recommended to reduce I*R drop. The processor V
CC
pins
must be supplied the voltage determined by the VID (Voltage ID) pins.
3.2
Decoupling Guidelines
Due to its large number of transistors and high internal clock speeds, the processor is
capable of generating large average current swings between low and full power states.
This may cause voltages on power planes to sag below their minimum values if bulk
decoupling is not adequate. Larger bulk storage, such as electrolytic capacitors, supply
current during longer lasting changes in current demand by the component, such as
coming out of an idle condition. Similarly, they act as a storage well for current when
entering an idle condition from a running condition. Care must be taken in the board
design to ensure that the voltage provided to the processor remains within the
specifications listed in the tables in
Section 3.10
. Failure to do so can result in timing
violations or reduced lifetime of the component.
3.2.1
V
CC
Decoupling
V
CC
regulator solutions need to provide bulk capacitance with a low Effective Series
Resistance (ESR) and keep a low interconnect resistance from the regulator to the
socket. Bulk decoupling for the large current swings when the part is powering on, or
entering/exiting low-power states, should be provided by the voltage regulator solution
depending on the specific system design.
3.2.2
FSB AGTL+ Decoupling
The processors integrate signal termination on the die as well as incorporate high
frequency decoupling capacitance on the processor package. Decoupling must also be
provided by the system motherboard for proper AGTL+ bus operation.
3.2.3
FSB Clock (BCLK[1:0]) and Processor Clocking
BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the
processor. As in previous-generation processors, the processor core frequency is a
multiple of the BCLK[1:0] frequency. The processor bus ratio multiplier will be set at its
default ratio at manufacturing. The processor uses a differential clocking
implementation.