Intel P8700 Data Sheet - Page 57
Intel Core 2 Duo Mobile Processor POP and LV Die Micro-FCBGA Processor, Package Drawing
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UPC - 735858206174
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Package Mechanical Specifications and Pin Information Figure 14. Intel Core 2 Duo Mobile Processor (POP and LV) Die Micro-FCBGA Processor Package Drawing Datasheet THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. B1 B (C1) B2 (C2) DIE PACKAGE (D1) TOP VIEW SEE DETAIL A FRONT VIEW Package Substrate Epoxy Underfill C A Die A DETAIL SCALE 45 SIDE VIEW G1 H1 J2 BC BA AW AU AR AN AL AJ AG AE AC AA W U R N L J G E C A BD BB AY AV AT AP AM AK AH AF AD AB Y V T P M K H F D B SEE DETAIL B 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 J1 BOTTOM VIEW G2 H2 F3 F5 A ø0.46±0.04 (Metal Diameter) B DETAIL SCALE 75 BGA LAND 956 PLACES ø0.39±0.02 (Solder Resist Opening) SYMBOL B1 B2 C1 C2 D1 F3 F5 G1 G2 H1 H2 J1 J2 MILLIMETERS MIN MAX 21.95 22.05 21.95 22.05 8.68 12.4 0.926 1.437 1.647 0.205 0.355 20.468 BASIC 20.468 BASIC 10.234 BASIC 10.234 BASIC 0.476 BASIC 0.476 BASIC COMMENTS ø0.14 L A B C ø0.04 L A B6749-01 D88065(1) 57
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