Intel P8700 Data Sheet - Page 52
MB and 3-MB on 6-MB Die Micro-FCPGA Package Drawing Sheet 1 of 2
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Package Mechanical Specifications and Pin Information Figure 9. 6-MB and 3-MB on 6-MB Die Micro-FCPGA Package Drawing (Sheet 1 of 2) 52 B B1 478 PINS G1 H1 C2 C1 TOP VIEW A FRONT VIEW B2 J2 G2 H2 A SIDE VIEW Die Underfill Package Substrate 0.37 MAX 0.65 MAX P A DETAIL SCALE 20 J1 F2 F3 0.65 MAX 2.03±0.08 C BOTTOM VIEW SYMBOL B1 B2 MILLIMETERS MIN MAX 34.95 35.05 34.95 35.05 C1 8.7 C2 12.4 F2 0.88 F3 1.862 2.102 G1 31.75 BASIC G2 31.75 BASIC H1 15.875 BASIC H2 15.875 BASIC J1 1.27 BASIC J2 1.27 BASIC P 0.255 0.355 W 6g Keying Pins COMMENTS ø0.356 M C A B ø0.254 M C A1, A2 B6887-01 D76563(1) Datasheet
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Package Mechanical Specifications and Pin Information
52
Datasheet
Figure 9.
6-MB and 3-MB on 6-MB Die Micro-FCPGA Package Drawing (Sheet 1 of 2)
B6887-01
D76563(1)
TOP VIEW
FRONT VIEW
SIDE VIEW
BOTTOM VIEW
DETAIL
A
SCALE 20
F
3
F
2
C
Package Substrate
Underfill
Die
0.37 MAX
0.65 MAX
0.65 MAX
2.03±0.08
P
A
478 PINS
B
A
B
2
B
1
C
2
C
1
H
2
J
1
J
2
G
2
H
1
G
1
B
1
34.95
34.95
35.05
1.862
2.102
0.255
0.355
35.05
SYMBOL
COMMENTS
MILLIMETERS
MIN
MAX
B
2
12.4
C
2
8.7
C
1
0.88
F
2
31.75 BASIC
G
2
31.75 BASIC
G
1
15.875 BASIC
H
2
15.875 BASIC
H
1
6g
Keying Pins
A1, A2
W
P
1.27 BASIC
J
2
1.27 BASIC
J
1
F
3
ø
0.356
C
C
A
M
B
ø
0.254
M