Intel P8700 Data Sheet - Page 104

Thermal Specifications and Design Considerations

104

Datasheet

NOTES:

1.

The TDP specification should be used to design the processor thermal solution. The TDP is not the

maximum theoretical power the processor can generate.

2.

Not 100% tested. These power specifications are determined by characterization of the processor currents

at higher temperatures and extrapolating the values for the temperature indicated.

3.

As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic

mode is used to indicate that the maximum T

J

has been reached.

4.

The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within

specifications.

5.

Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser than TDP in HFM.

6.

At Tj of 105

o

C

7.

At Tj of 50 °C

8.

At Tj of 35

o

C

Table 23.

Power Specifications for the Dual-Core Power Optimized Performance (25 W)

SFF Processors

Symbol

Processor

Number

Core Frequency & Voltage

Thermal Design

Power

Unit

Notes

TDP

SP9600

SP9400

SP9300

2.53 GHz & HFM V

CC

2.4 GHz & HFM V

CC

2.26 GHz & HFM V

CC

1.6 GHz & Super LFM V

CC

0.8 GHz & Super LFM V

CC

25

25

25

20

11

W

1, 4, 5,

6

Symbol

Parameter

Min

Typ

Max

Unit

Notes

P

AH,

P

SGNT

Auto Halt, Stop Grant Power

at V

CCHFM

at V

CCSLFM

—

—

8.3

3.3

W

2, 5, 7

P

SLP

Sleep Power

at V

CCHFM

at V

CCSLFM

—

—

7.5

3.1

W

2, 5, 7

P

DSLP

Deep Sleep Power

at V

CCHFM

at V

CCSLFM

—

—

2.9

1.8

W

2, 5, 8

P

DPRSLP

Deeper Sleep Power

—

—

1.0

W

2, 8

P

DC4

Intel® Enhanced Deeper Sleep State Power

—

—

0.9

W

2, 8

P

C6

Intel® Deep Power Down Power

—

—

0.3

W

2, 8

T

J

Junction Temperature

0

—

105

°

C

3, 4

Section	Page
Intel® Core™2 Duo Mobile Processor, Intel® Core™2 Solo Mobile Processor and Intel® Core™2 Extreme Mobile Processor on 45-nm Process	1
Revision History	6
1 Introduction	7
1.1 Terminology	8
1.2 References	9
2 Low Power Features	11
2.1 Clock Control and Low-Power States	11
2.1.1 Core Low-Power State Descriptions	13
2.1.2 Package Low-power State Descriptions	15
2.2 Enhanced Intel SpeedStep® Technology	19
2.3 Extended Low-Power States	20
2.4 FSB Low Power Enhancements	21
2.4.1 Dynamic FSB Frequency Switching	21
2.4.2 Enhanced Intel® Dynamic Acceleration Technology	22
2.5 VID-x	23
2.6 Processor Power Status Indicator (PSI-2) Signal	23
3 Electrical Specifications	25
3.1 Power and Ground Pins	25
3.2 Decoupling Guidelines	25
3.2.1 VCC Decoupling	25
3.2.2 FSB AGTL+ Decoupling	25
3.2.3 FSB Clock (BCLK[1:0]) and Processor Clocking	25
3.3 Voltage Identification and Power Sequencing	26
3.4 Catastrophic Thermal Protection	29
3.5 Reserved and Unused Pins	29
3.6 FSB Frequency Select Signals (BSEL[2:0])	29
3.7 FSB Signal Groups	30
3.8 CMOS Signals	31
3.9 Maximum Ratings	31
3.10 Processor DC Specifications	32
4 Package Mechanical Specifications and Pin Information	51
4.1 Package Mechanical Specifications	51
4.2 Processor Pinout and Pin List	59
4.3 Alphabetical Signals Reference	93
5 Thermal Specifications and Design Considerations	101
5.1 Monitoring Die Temperature	108
5.1.1 Thermal Diode	108
5.1.2 Intel® Thermal Monitor	109
5.1.3 Digital Thermal Sensor	111
5.2 Out of Specification Detection	112

Intel P8700 Data Sheet - Page 104

Table 23., Power Specifications for the Dual-Core Power Optimized Performance 25 W, SFF Processors

Page 104 highlights