IBM 8676 Hardware Maintenance Manual - Page 79

Service, replaceable, units

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Chapter 5. Service replaceable units This chapter describes the removal of server components. Important: The field replaceable unit (FRU) procedures are intended for trained servicers who are familiar with IBM xSeries products. See the parts listing in "System" on page 112 to determine if the component being replaced is a customer replaceable unit (CRU) or a FRU. Thermal grease This section contains information about removing and replacing the thermal grease between the heat sink and the microprocessor. The thermal grease must be replaced anytime the heat sink has been removed from the top of the microprocessor and is going to be reused, or when debris is found in the grease. Note: v Read "Installation guidelines" on page 37. v Read the safety notices at "Safety information" on page 119. v Read "Handling electrostatic discharge-sensitive devices" on page 122. Complete the following steps to replace damaged or contaminated thermal grease on the microprocessor and heat sink: 1. Place the heat sink on a clean work surface. 2. Remove the cleaning pad from its package and unfold it completely. 3. Use the cleaning pad to wipe the thermal grease from the bottom of the heat sink. Note: Be sure that all of the thermal grease is removed. 4. Use a clean area of the cleaning pad to wipe the thermal grease from the microprocessor; then, dispose of the cleaning pad after all of the thermal grease is removed. Microprocessor 0.01 mL of thermal grease 5. Use the thermal grease syringe to place 16 uniformly spaced dots of 0.01 mL each on the top of the microprocessor. © Copyright IBM Corp. 2002 69

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Chapter
5.
Service
replaceable
units
This
chapter
describes
the
removal
of
server
components.
Important:
The
field
replaceable
unit
(FRU)
procedures
are
intended
for
trained
servicers
who
are
familiar
with
IBM
xSeries
products.
See
the
parts
listing
in
“System”
on
page
112
to
determine
if
the
component
being
replaced
is
a
customer
replaceable
unit
(CRU)
or
a
FRU.
Thermal
grease
This
section
contains
information
about
removing
and
replacing
the
thermal
grease
between
the
heat
sink
and
the
microprocessor.
The
thermal
grease
must
be
replaced
anytime
the
heat
sink
has
been
removed
from
the
top
of
the
microprocessor
and
is
going
to
be
reused,
or
when
debris
is
found
in
the
grease.
Note:
v
Read
“Installation
guidelines”
on
page
37.
v
Read
the
safety
notices
at
“Safety
information”
on
page
119.
v
Read
“Handling
electrostatic
discharge-sensitive
devices”
on
page
122.
Complete
the
following
steps
to
replace
damaged
or
contaminated
thermal
grease
on
the
microprocessor
and
heat
sink:
1.
Place
the
heat
sink
on
a
clean
work
surface.
2.
Remove
the
cleaning
pad
from
its
package
and
unfold
it
completely.
3.
Use
the
cleaning
pad
to
wipe
the
thermal
grease
from
the
bottom
of
the
heat
sink.
Note:
Be
sure
that
all
of
the
thermal
grease
is
removed.
4.
Use
a
clean
area
of
the
cleaning
pad
to
wipe
the
thermal
grease
from
the
microprocessor;
then,
dispose
of
the
cleaning
pad
after
all
of
the
thermal
grease
is
removed.
Microprocessor
0.01 mL of
thermal grease
5.
Use
the
thermal
grease
syringe
to
place
16
uniformly
spaced
dots
of
0.01
mL
each
on
the
top
of
the
microprocessor.
©
Copyright
IBM
Corp.
2002
69