Intel 521 Data Sheet - Page 3

Contents Contents 1 Introduction...11 1.1 Terminology ...12 1.1.1 Processor Packaging Terminology 12 1.2 References ...13 2 Electrical Specifications ...15 2.1 FSB and GTLREF...15 2.2 Power and Ground Lands 15 2.3 Decoupling Guidelines...15 2.3.1 VCC Decoupling ...16 2.3.2 FSB GTL+ Decoupling 16 2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking 16 2.4 Voltage Identification ...17 2.4.1 Phase Lock Loop (PLL) Power and Filter 19 2.5 Reserved, Unused, FC and TESTHI Signals 20 2.6 FSB Signal Groups ...21 2.7 GTL+ Asynchronous Signals 22 2.8 Test Access Port (TAP) Connection 23 2.9 FSB Frequency Select Signals (BSEL[2:0 23 2.10 Absolute Maximum and Minimum Ratings 24 2.11 Processor DC Specifications 24 2.12 VCC Overshoot Specification 33 2.12.1 Die Voltage Validation 33 2.13 GTL+ FSB Specifications...34 3 Package Mechanical Specifications 35 3.1 Package Mechanical Drawing 35 3.2 Processor Component Keep-Out Zones 39 3.3 Package Loading Specifications 39 3.4 Package Handling Guidelines 39 3.5 Package Insertion Specifications 40 3.6 Processor Mass Specification 40 3.7 Processor Materials ...40 3.8 Processor Markings ...40 3.9 Processor Land Coordinates 41 4 Land Listing and Signal Descriptions 43 4.1 Processor Land Assignments 43 4.2 Alphabetical Signals Reference 66 5 Thermal Specifications and Design Considerations 75 5.1 Processor Thermal Specifications 75 5.1.1 Thermal Specifications 75 5.1.2 Thermal Metrology 79 5.2 Processor Thermal Features 79 5.2.1 Thermal Monitor...79 5.2.2 Thermal Monitor 2 80 Datasheet 3