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Intel 521 Data Sheet - Page 93

Thermal Specifications

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Boxed Processor Specifications Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket R4.33 [110] B C 7.3 7.3.1 Thermal Specifications This section describes the cooling requirements of the fan heatsink solution used by the boxed processor. Boxed Processor Cooling Requirements The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's temperature specification is also a function of the thermal design of the entire system, and ultimately the responsibility of the system integrator. The processor temperature specification is in Chapter 5. The boxed processor fan heatsink is able to keep the processor temperature within the specifications (see Table 5-1) in chassis that provide good thermal management. For the boxed processor fan heatsink to operate properly, it is critical that the airflow provided to the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan life. Figure 7-7 and Figure 7-8 illustrate an acceptable airspace clearance for the fan heatsink. The air temperature entering the fan should be kept below 38 ºC. Again, meeting the processor's temperature specification is the responsibility of the system integrator. Datasheet 93

Section	Page
Contents	3
Revision History	7
Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520/521	9
1 Introduction	11
1.1 Terminology	12
1.1.1 Processor Packaging Terminology	12
1.2 References	13
2 Electrical Specifications	15
2.1 FSB and GTLREF	15
2.2 Power and Ground Lands	15
2.3 Decoupling Guidelines	15
2.3.1 VCC Decoupling	16
2.3.2 FSB GTL+ Decoupling	16
2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking	16
2.4 Voltage Identification	17
2.4.1 Phase Lock Loop (PLL) Power and Filter	19
2.5 Reserved, Unused, FC and TESTHI Signals	20
2.6 FSB Signal Groups	21
2.7 GTL+ Asynchronous Signals	22
2.8 Test Access Port (TAP) Connection	23
2.9 FSB Frequency Select Signals (BSEL[2:0])	23
2.10 Absolute Maximum and Minimum Ratings	24
2.11 Processor DC Specifications	24
2.12 VCC Overshoot Specification	33
2.12.1 Die Voltage Validation	33
2.13 GTL+ FSB Specifications	34
3 Package Mechanical Specifications	35
3.1 Package Mechanical Drawing	35
3.2 Processor Component Keep-Out Zones	39
3.3 Package Loading Specifications	39
3.4 Package Handling Guidelines	39
3.5 Package Insertion Specifications	40
3.6 Processor Mass Specification	40
3.7 Processor Materials	40
3.8 Processor Markings	40
3.9 Processor Land Coordinates	41
4 Land Listing and Signal Descriptions	43
4.1 Processor Land Assignments	43
4.2 Alphabetical Signals Reference	66
5 Thermal Specifications and Design Considerations	75
5.1 Processor Thermal Specifications	75
5.1.1 Thermal Specifications	75
5.1.2 Thermal Metrology	79
5.2 Processor Thermal Features	79
5.2.1 Thermal Monitor	79
5.2.2 Thermal Monitor 2	80
5.2.3 On-Demand Mode	81
5.2.4 PROCHOT# Signal	82
5.2.5 THERMTRIP# Signal	82
5.2.6 TCONTROL and Fan Speed Reduction	82
5.2.7 Thermal Diode	83
6 Features	85
6.1 Power-On Configuration Options	85
6.2 Clock Control and Low Power States	85
6.2.1 Normal State	86
6.2.2 HALT and Enhanced HALT Powerdown States	86
6.2.2.1 HALT Powerdown State	86
6.2.2.2 Enhanced HALT Powerdown State	86
6.2.3 Stop-Grant State	87
6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State	88
6.2.4.1 HALT Snoop State, Grant Snoop State	88
6.2.4.2 Enhanced HALT Snoop State	88
7 Boxed Processor Specifications	89
7.1 Mechanical Specifications	90
7.1.1 Boxed Processor Cooling Solution Dimensions	90
7.1.2 Boxed Processor Fan Heatsink Weight	91
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	91
7.2 Electrical Requirements	91
7.2.1 Fan Heatsink Power Supply	91
7.3 Thermal Specifications	93
7.3.1 Boxed Processor Cooling Requirements	93

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Datasheet

Boxed Processor Specifications

7.3

Thermal Specifications

This section describes the cooling requirements of the fan heatsink solution used by the boxed

processor.

7.3.1

Boxed Processor Cooling Requirements

The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's

temperature specification is also a function of the thermal design of the entire system, and

ultimately the responsibility of the system integrator. The processor temperature specification is in

Chapter 5

. The boxed processor fan heatsink is able to keep the processor temperature within the

specifications (see

Table 5-1

) in chassis that provide good thermal management. For the boxed

processor fan heatsink to operate properly, it is critical that the airflow provided to the fan heatsink

is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.

Airspace is required around the fan to ensure that the airflow through the fan heatsink is not

blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan

life.

Figure 7-7

and

Figure 7-8

illustrate an acceptable airspace clearance for the fan heatsink. The

air temperature entering the fan should be kept below 38 ºC. Again, meeting the processor's

temperature specification is the responsibility of the system integrator.

Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket

R4.33

[110]