Intel 521 Data Sheet - Page 76

Thermal Specifications and Design Considerations

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Thermal Specifications and Design Considerations The case temperature is defined at the geometric top center of the processor IHS. Analysis indicates that real applications are unlikely to cause the processor to consume maximum power dissipation for sustained periods of time. Intel recommends that complete thermal solution designs target the Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor power consumption. The Thermal Monitor feature is intended to help protect the processor in the unlikely event that an application exceeds the TDP recommendation for a sustained period of time. For more details on the usage of this feature, refer to Section 5.2. In all cases, the Thermal Monitor feature must be enabled for the processor to remain within specification. Table 5-1. Processor Thermal Specifications Processor Core Frequency Thermal Design Minimum TC Number (GHz) Power (W) (°C) Maximum TC (°C) Notes 520/521 530/531 540/541 550/551 550 560/561 570/571 2.80 (PRB = 0) 3 (PRB = 0) 3.20 (PRB = 0) 3.40 (PRB = 0) 3.40 (PRB = 1) 3.60 (PRB = 1) 3.80 (PRB = 1) 84 5 See Table 5-3 and Figure 5-2 1, 2 84 5 See Table 5-3 and Figure 5-2 1, 2 84 5 See Table 5-3 and Figure 5-2 1, 2 84 5 See Table 5-3 and Figure 5-2 1, 2 115 5 See Table 5-2 and Figure 5-1 1, 2 115 5 See Table 5-2 and Figure 5-1 1, 2 115 5 See Table 5-2 and Figure 5-1 1, 2 NOTES: 1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the processor can dissipate. 2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the maximum TC will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for the allowed combinations of power and TC. 76 Datasheet

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76
Datasheet
Thermal Specifications and Design Considerations
The case temperature is defined at the geometric top center of the processor IHS. Analysis indicates
that real applications are unlikely to cause the processor to consume maximum power dissipation for
sustained periods of time. Intel recommends that complete thermal solution designs target the
Thermal Design Power (TDP) indicated in
Table 5-1
instead of the maximum processor power
consumption. The Thermal Monitor feature is intended to help protect the processor in the unlikely
event that an application exceeds the TDP recommendation for a sustained period of time. For more
details on the usage of this feature, refer to
Section 5.2
.
In all cases, the Thermal Monitor feature
must be enabled for the processor to remain within specification.
Table 5-1. Processor Thermal Specifications
Processor
Number
Core Frequency
(GHz)
Thermal Design
Power (W)
Minimum T
C
(°C)
Maximum T
C
(°C)
Notes
520/521
2.80 (PRB = 0)
84
5
See
Table 5-3
and
Figure 5-2
1
,
2
530/531
3 (PRB = 0)
84
5
See
Table 5-3
and
Figure 5-2
1
,
2
540/541
3.20 (PRB = 0)
84
5
See
Table 5-3
and
Figure 5-2
1
,
2
550/551
3.40 (PRB = 0)
84
5
See
Table 5-3
and
Figure 5-2
1
,
2
550
3.40 (PRB = 1)
115
5
See
Table 5-2
and
Figure 5-1
1, 2
NOTES:
1.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum pow-
er that the processor can dissipate.
2.
This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the
maximum T
C
will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table
for the allowed combinations of power and T
C
.
560/561
3.60 (PRB = 1)
115
5
See
Table 5-2
and
Figure 5-1
1
,
2
570/571
3.80 (PRB = 1)
115
5
See
Table 5-2
and
Figure 5-1
1
,
2