Intel 521 Data Sheet - Page 39

Package Mechanical Specifications 3.2 Processor Component Keep-Out Zones The processor may contain components on the substrate that define component keep-out zone requirements. A thermal and mechanical solution design must not intrude into the required keepout zones. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure 3-2 and Figure 3-3 for keep-out zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in. 3.3 Package Loading Specifications Table 3-1 provides dynamic and static load specifications for the processor package. These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load-bearing surface for thermal and mechanical solution. The minimum loading specification must be maintained by any thermal and mechanical solutions. . Table 3-1. Processor Loading Specifications Parameter Minimum Maximum Notes Static Dynamic 80 N [18 lbf] - 311 N [70 lbf] 756 N [170 lbf] 1, 2, 3 1, 3, 4 NOTES: 1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS. 2. This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the minimum specified load on the processor package. 3. These specifications are based on limited testing for design characterization. Loading limits are for the package only and does not include the limits of the processor socket. 4. Dynamic loading is defined as the sum of the load on the package from a 1 lb heatsink mass accelerating through a 11 ms trapezoidal pulse of 50 g and the maximum static load. 3.4 Package Handling Guidelines Table 3-2 includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal. Table 3-2. Package Handling Guidelines Parameter Maximum Recommended Notes Shear 311 N [70 lbf] 1, 4 Tensile 111 N [25 lbf] 2, 4 Torque 3.95 N-m [35 lbf-in] 3, 4 NOTES: 1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface. 2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface. 3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface. 4. These guidelines are based on limited testing for design characterization. Datasheet 39