Intel 521 Data Sheet - Page 89
Boxed Processor Specifications
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Boxed Processor Specifications 7 Boxed Processor Specifications The Pentium 4 processor on 90 nm process in the 775-land package will also be offered as a boxed Intel processor. Boxed Intel processors are intended for system integrators who build systems from baseboards and standard components. The boxed Pentium 4 processor in the 775-land package will be supplied with a cooling solution. This chapter documents baseboard and system requirements for the cooling solution that will be supplied with the boxed Pentium 4 processor in the 775-land package. This chapter is particularly important for OEMs that manufacture baseboards for system integrators. Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and inches [in brackets]. Figure 7-1 shows a mechanical representation of a boxed Pentium 4 processor in the 775-land package. Note: Drawings in this section reflect only the specifications on the boxed Intel processor product. These dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system designers' responsibility to consider their proprietary cooling solution when designing to the required keep-out zone on their system platforms and chassis. Refer to the Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines for further guidance. Contact your local Intel Sales Representative for this document. Figure 7-1. Mechanical Representation of the Boxed Processor NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink. Datasheet 89