Intel E3300 Data Sheet - Page 33

Package Mechanical Specifications 3 Package Mechanical Specifications Figure 5. The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA8) package that interfaces with the motherboard using an LGA775 socket. The package consists of a processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor component thermal solutions, such as a heatsink. Figure 5 shows a sketch of the processor package components and how they are assembled together. Refer to the LGA775 Socket Mechanical Design Guide for complete details on the LGA775 socket. The package components shown in Figure 5 include the following: • Integrated Heat Spreader (IHS) • Thermal Interface Material (TIM) • Processor core (die) • Package substrate • Capacitors Processor Package Assembly Sketch Core (die) TIM IHS Substrate 3.1 System Board Capacitors LGA775 Socket P roc es s or_P k g_A s se mb ly _7 75 NOTE: 1. Socket and motherboard are included for reference and are not part of processor package. Package Mechanical Drawing The package mechanical drawings are shown in Figure 6 and Figure 7. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include: • Package reference with tolerances (total height, length, width, and so on) • IHS parallelism and tilt • Land dimensions • Top-side and back-side component keep-out dimensions • Reference datums • All drawing dimensions are in mm [in]. • Guidelines on potential IHS flatness variation with socket load plate actuation and installation of the cooling solution is available in the processor Thermal and Mechanical Design Guidelines. Datasheet 33