Intel E3300 Data Sheet - Page 5

Intel E3300 Manual

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Figures 1 Processor VCC Static and Transient Tolerance 20 2 VCC Overshoot Example Waveform 21 3 Differential Clock Waveform 30 4 Measurement Points for Differential Clock Waveforms 31 5 Processor Package Assembly Sketch 33 6 Processor Package Drawing Sheet 1 of 3 34 7 Processor Package Drawing Sheet 2 of 3 35 8 Processor Package Drawing Sheet 3 of 3 36 9 Intel® Celeron® Processor E3000 Series Top-Side Markings Example 38 10 Processor Land Coordinates and Quadrants, Top View 39 11 land-out Diagram (Top View - Left Side 42 12 land-out Diagram (Top View - Right Side 43 13 Processor Series Thermal Profile 77 14 Case Temperature (TC) Measurement Location 78 15 Thermal Monitor 2 Frequency and Voltage Ordering 80 16 Conceptual Fan Control Diagram on PECI-Based Platforms 82 17 Processor Low Power State Machine 86 18 Mechanical Representation of the Boxed Processor 91 19 Space Requirements for the Boxed Processor (Side View 92 20 Space Requirements for the Boxed Processor (Top View 92 21 Overall View Space Requirements for the Boxed Processor 93 22 Boxed Processor Fan Heatsink Power Cable Connector Description 94 23 Baseboard Power Header Placement Relative to Processor Socket 95 24 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view 96 25 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view 96 26 Boxed Processor Fan Heatsink Set Points 97 Datasheet 5

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Datasheet
5
Figures
1
Processor V
CC
Static and Transient Tolerance
...............................................................
20
2
V
CC
Overshoot Example Waveform
.............................................................................
21
3
Differential Clock Waveform
......................................................................................
30
4
Measurement Points for Differential Clock Waveforms
...................................................
31
5
Processor Package Assembly Sketch
...........................................................................
33
6
Processor Package Drawing Sheet 1 of 3
.....................................................................
34
7
Processor Package Drawing Sheet 2 of 3
.....................................................................
35
8
Processor Package Drawing Sheet 3 of 3
.....................................................................
36
9
Intel
®
Celeron
®
Processor E3000 Series Top-Side Markings Example
..............................
38
10
Processor Land Coordinates and Quadrants, Top View
...................................................
39
11
land-out Diagram (Top View – Left Side)
.....................................................................
42
12
land-out Diagram (Top View – Right Side)
...................................................................
43
13
Processor Series Thermal Profile
................................................................................
77
14
Case Temperature (TC) Measurement Location
............................................................
78
15
Thermal Monitor 2 Frequency and Voltage Ordering
......................................................
80
16
Conceptual Fan Control Diagram on PECI-Based Platforms
.............................................
82
17
Processor Low Power State Machine
...........................................................................
86
18
Mechanical Representation of the Boxed Processor
.......................................................
91
19
Space Requirements for the Boxed Processor (Side View)
..............................................
92
20
Space Requirements for the Boxed Processor (Top View)
...............................................
92
21
Overall View Space Requirements for the Boxed Processor
.............................................
93
22
Boxed Processor Fan Heatsink Power Cable Connector Description
..................................
94
23
Baseboard Power Header Placement Relative to Processor Socket
...................................
95
24
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view)
...................
96
25
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view)
...................
96
26
Boxed Processor Fan Heatsink Set Points
.....................................................................
97