Intel E3300 Data Sheet - Page 91

Boxed Processor Specifications

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Boxed Processor Specifications 7 Boxed Processor Specifications 7.1 Introduction The processor will also be offered as an Intel boxed processor. Intel boxed processors are intended for system integrators who build systems from baseboards and standard components. The boxed processor will be supplied with a cooling solution. This chapter documents baseboard and system requirements for the cooling solution that will be supplied with the boxed processor. This chapter is particularly important for OEMs that manufacture baseboards for system integrators. Note: Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and inches [in brackets]. Figure 18 shows a mechanical representation of a boxed processor. Note: Figure 18. Drawings in this section reflect only the specifications on the Intel boxed processor product. These dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system designers' responsibility to consider their proprietary cooling solution when designing to the required keep-out zone on their system platforms and chassis. Refer to the appropriate Thermal and Mechanical Design Guidelines (see Section 1.2) for further guidance. Contact your local Intel Sales Representative for this document. Mechanical Representation of the Boxed Processor NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink. Datasheet 91

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Datasheet
91
Boxed Processor Specifications
7
Boxed Processor Specifications
7.1
Introduction
The processor will also be offered as an Intel boxed processor. Intel boxed processors
are intended for system integrators who build systems from baseboards and standard
components. The boxed processor will be supplied with a cooling solution. This chapter
documents baseboard and system requirements for the cooling solution that will be
supplied with the boxed processor. This chapter is particularly important for OEMs that
manufacture baseboards for system integrators.
Note:
Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and
inches [in brackets].
Figure 18
shows a mechanical representation of a boxed
processor.
Note:
Drawings in this section reflect only the specifications on the Intel boxed processor
product. These dimensions should not be used as a generic keep-out zone for all
cooling solutions. It is the system designers’ responsibility to consider their proprietary
cooling solution when designing to the required keep-out zone on their system
platforms and chassis. Refer to the appropriate Thermal and Mechanical Design
Guidelines (see
Section 1.2
)
for further guidance. Contact your local Intel Sales
Representative for this document.
NOTE:
The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
Figure 18.
Mechanical Representation of the Boxed Processor