Intel E3300 Data Sheet - Page 99

Debug Tools Specifications

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Debug Tools Specifications 8 Debug Tools Specifications 8.1 8.1.1 8.1.2 Logic Analyzer Interface (LAI) Intel is working with two logic analyzer vendors to provide logic analyzer interfaces (LAIs) for use in debugging Intel Celeron® processor E3000 series systems. Tektronix and Agilent should be contacted to get specific information about their logic analyzer interfaces. The following information is general in nature. Specific information must be obtained from the logic analyzer vendor. Due to the complexity of Intel Celeron® processor E3000 series systems, the LAI is critical in providing the ability to probe and capture FSB signals. There are two sets of considerations to keep in mind when designing an Intel Celeron® processor E3000 series system that can make use of an LAI: mechanical and electrical. Mechanical Considerations The LAI is installed between the processor socket and the processor. The LAI lands plug into the processor socket, while the processor lands plug into a socket on the LAI. Cabling that is part of the LAI egresses the system to allow an electrical connection between the processor and a logic analyzer. The maximum volume occupied by the LAI, known as the keepout volume, as well as the cable egress restrictions, should be obtained from the logic analyzer vendor. System designers must make sure that the keepout volume remains unobstructed inside the system. Note that it is possible that the keepout volume reserved for the LAI may differ from the space normally occupied by the processor heatsink. If this is the case, the logic analyzer vendor will provide a cooling solution as part of the LAI. Electrical Considerations The LAI will also affect the electrical performance of the FSB; therefore, it is critical to obtain electrical load models from each of the logic analyzers to be able to run system level simulations to prove that their tool will work in the system. Contact the logic analyzer vendor for electrical specifications and load models for the LAI solution it provides. § Datasheet 99

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Datasheet
99
Debug Tools Specifications
8
Debug Tools Specifications
8.1
Logic Analyzer Interface (LAI)
Intel is working with two logic analyzer vendors to provide logic analyzer interfaces
(LAIs) for use in debugging Intel Celeron
®
processor E3000 series systems. Tektronix
and Agilent should be contacted to get specific information about their logic analyzer
interfaces. The following information is general in nature. Specific information must be
obtained from the logic analyzer vendor.
Due to the complexity of Intel Celeron
®
processor E3000 series systems, the LAI is
critical in providing the ability to probe and capture FSB signals. There are two sets of
considerations to keep in mind when designing an Intel Celeron
®
processor E3000
series system that can make use of an LAI: mechanical and electrical.
8.1.1
Mechanical Considerations
The LAI is installed between the processor socket and the processor. The LAI lands plug
into the processor socket, while the processor lands plug into a socket on the LAI.
Cabling that is part of the LAI egresses the system to allow an electrical connection
between the processor and a logic analyzer. The maximum volume occupied by the LAI,
known as the keepout volume, as well as the cable egress restrictions, should be
obtained from the logic analyzer vendor. System designers must make sure that the
keepout volume remains unobstructed inside the system. Note that it is possible that
the keepout volume reserved for the LAI may differ from the space normally occupied
by the processor heatsink. If this is the case, the logic analyzer vendor will provide a
cooling solution as part of the LAI.
8.1.2
Electrical Considerations
The LAI will also affect the electrical performance of the FSB; therefore, it is critical to
obtain electrical load models from each of the logic analyzers to be able to run system
level simulations to prove that their tool will work in the system. Contact the logic
analyzer vendor for electrical specifications and load models for the LAI solution it
provides.
§