Intel E3300 Data Sheet - Page 92

Mechanical Specifications

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Boxed Processor Specifications 7.2 Mechanical Specifications 7.2.1 Boxed Processor Cooling Solution Dimensions This section documents the mechanical specifications of the boxed processor. The boxed processor will be shipped with an unattached fan heatsink. Figure 18 shows a mechanical representation of the boxed processor. Figure 19. Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and dimensions for the boxed processor with assembled fan heatsink are shown in Figure 19 (Side View), and Figure 20 (Top View). The airspace requirements for the boxed processor fan heatsink must also be incorporated into new baseboard and system designs. Airspace requirements are shown in Figure 24 and Figure 25. Note that some figures have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning. Space Requirements for the Boxed Processor (Side View) 95.0 [3.74] 81.3 [3.2] 10.0 [0.39] 25.0 [0.98] Figure 20. Space Requirements for the Boxed Processor (Top View) B d P Sid Vi 95.0 [3.74] 95.0 [3.74] NOTES: 1. Diagram does not show the attached hardware for the clip design and is provided only as a mechanical representation. 92 Datasheet

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Boxed Processor Specifications
92
Datasheet
7.2
Mechanical Specifications
7.2.1
Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed processor. The
boxed processor will be shipped with an unattached fan heatsink.
Figure 18
shows a
mechanical representation of the boxed processor.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper
cooling. The physical space requirements and dimensions for the boxed processor with
assembled fan heatsink are shown in
Figure 19
(Side View), and
Figure 20
(Top View).
The airspace requirements for the boxed processor fan heatsink must also be
incorporated into new baseboard and system designs. Airspace requirements are
shown in
Figure 24
and
Figure 25
. Note that some figures have centerlines shown
(marked with alphabetic designations) to clarify relative dimensioning.
NOTES:
1.
Diagram does not show the attached hardware for the clip design and is provided only as a
mechanical representation.
Figure 19.
Space Requirements for the Boxed Processor (Side View)
Figure 20.
Space Requirements for the Boxed Processor (Top View)
B
dP
Sid Vi
95.0
[3.74]
10.0
[0.39]
25.0
[0.98]
81.3
[3.2]
95.0
[3.74]
95.0
[3.74]