Intel E3300 Data Sheet - Page 95

Thermal Specifications

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Boxed Processor Specifications Figure 23. Baseboard Power Header Placement Relative to Processor Socket R110 [4.33] B C 7.4 7.4.1 Thermal Specifications This section describes the cooling requirements of the fan heatsink solution used by the boxed processor. Boxed Processor Cooling Requirements The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's temperature specification is also a function of the thermal design of the entire system, and ultimately the responsibility of the system integrator. The processor temperature specification is provided in Chapter 5. The boxed processor fan heatsink is able to keep the processor temperature within the specifications (see Table 25) in chassis that provide good thermal management. For the boxed processor fan heatsink to operate properly, it is critical that the airflow provided to the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan life. Figure 24 and Figure 25 illustrate an acceptable airspace clearance for the fan heatsink. The air temperature entering the fan should be kept below 38 ºC. Again, meeting the processor's temperature specification is the responsibility of the system integrator. Datasheet 95

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Datasheet
95
Boxed Processor Specifications
7.4
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the
boxed processor.
7.4.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is provided in
Chapter 5
. The boxed processor fan heatsink is
able to keep the processor temperature within the specifications (see
Table 25
) in
chassis that provide good thermal management. For the boxed processor fan heatsink
to operate properly, it is critical that the airflow provided to the fan heatsink is
unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan
heatsink. Airspace is required around the fan to ensure that the airflow through the fan
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling
efficiency and decreases fan life.
Figure 24
and
Figure 25
illustrate an acceptable
airspace clearance for the fan heatsink. The air temperature entering the fan should be
kept below 38 ºC. Again, meeting the processor's temperature specification is the
responsibility of the system integrator.
Figure 23.
Baseboard Power Header Placement Relative to Processor Socket
B
C
R110
[4.33]