Intel Q9400S Design Guidelines - Page 100
BizLink USA Technology, Inc.
UPC - 735858207973
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Balanced Technology Extended (BTX) System Thermal Considerations The thermal sensor location and elevation are reflected in the Flotherm thermal model airflow illustration and pictures (see Figure 56 and Figure 57).The Intel Boxed Boards in BTX form factor have implemented a System Monitor thermal sensor. The following thermal sensor or its equivalent can be used for this function: Part Number: C83274-002 BizLink USA Technology, Inc. 44911 Industrial Drive Fremont, CA 94538 USA (510)252-0786 phone (510)252-1178 fax [email protected] Part Number: 68801-0170 Molex Incorporated 2222 Wellington Ct. Lisle, IL 60532 1-800-78MOLEX phone 1-630-969-1352 fax [email protected] Figure 56. System Airflow Illustration with System Monitor Point Area Identified Power Supply Unit Graphics Add-In Card Memory Monitor Point MCH Thermal Module OM16791 100 Thermal and Mechanical Design Guidelines