Intel Q9400S Design Guidelines - Page 88
Third Tape Installation, Measuring Resistance between Thermocouple and IHS
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Figure 40. Third Tape Installation Case Temperature Reference Metrology 12. Place a 3rd piece of tape at the end of the step in the groove as shown in Figure 40. This tape will create a solder dam to prevent solder from flowing into the larger IHS groove section during the melting process. 13. Measure resistance from thermocouple end wires (hold both wires to a DMM probe) to the IHS surface. This should be the same value as measured during the thermocouple conditioning step D.5.1.step 3 (see Figure 41) Figure 41. Measuring Resistance between Thermocouple and IHS 88 Thermal and Mechanical Design Guidelines
Case Temperature Reference Metrology
88
Thermal and Mechanical Design Guidelines
Figure 40. Third Tape Installation
12.
Place a 3
rd
piece of tape at the end of the step in the groove as shown in
Figure 40. This tape will create a solder dam to prevent solder from flowing into
the larger IHS groove section during the melting process.
13.
Measure resistance from thermocouple end wires (hold both wires to a DMM
probe) to the IHS surface. This should be the same value as measured during the
thermocouple conditioning step
D.5.1.step 3 (see Figure 41)
Figure 41. Measuring Resistance between Thermocouple and IHS