Intel Q9400S Design Guidelines - Page 52

Intel® Thermal/Mechanical Reference Design Information

52

Thermal and Mechanical Design Guidelines

5.5

Safety Requirements

Heatsink and attachment assemblies shall be consistent with the manufacture of units

that meet the safety standards:



UL Recognition-approved for flammability at the system level. All mechanical and

thermal enabling components must be a minimum UL94V-2 approved.



CSA Certification. All mechanical and thermal enabling components must have

CSA certification.



All components (in particular the heatsink fins) must meet the test requirements

of UL1439 for sharp edges.



If the International Accessibility Probe specified in IEC 950 can access the moving

parts of the fan, consider adding safety feature so that there is no risk of personal

injury.

5.6

Geometric Envelope for Intel

®

Reference ATX

Thermal Mechanical Design

Figure 58, Figure 59 and Figure 60 in

Appendix F gives detailed reference ATX/

μ

ATX

motherboard keep-out information for the reference thermal/mechanical enabling

design. These drawings include height restrictions in the enabling component region.

The maximum height of the reference solution above the motherboard is 71.12 mm

[2.8 inches], and is compliant with the motherboard primary side height constraints

defined in the

ATX Specification revision 2.2

and the

microATX Motherboard Interface

Specification revision 1.2

found at

http://www.formfactors.org

. The reference solution

requires a chassis obstruction height of at least 81.28 mm [3.2 inches], measured

from the top of the motherboard (refer to Sections

3.3 and

5.2.4). This allows for

appropriate fan inlet airflow to ensure fan performance, and therefore overall cooling

solution performance. This is compliant with the recommendations found in both

ATX

Specification V2.2

and

microATX Motherboard Interface Specification V1.2

documents.

Figure 61 through Figure 65 gives the motherboard keep-out information for the BTX

thermal mechanical solutions. Additional information on BTX design considerations can

be found in

Balanced Technology Extended (BTX) System Design Guide

available at

http://www.formfactors.org

.

Section	Page
1 Introduction	11
1.1 Document Goals and Scope	11
1.1.1 Importance of Thermal Management	11
1.1.2 Document Goals	11
1.1.3 Document Scope	12
1.2 References	13
1.3 Definition of Terms	14
2 Processor Thermal/Mechanical Information	17
2.1 Mechanical Requirements	17
2.1.1 Processor Package	17
2.1.2 Heatsink Attach	19
2.1.2.1 General Guidelines	19
2.1.2.2 Heatsink Clip Load Requirement	19
2.1.2.3 Additional Guidelines	20
2.2 Thermal Requirements	20
2.2.1 Processor Case Temperature	20
2.2.2 Thermal Profile	21
2.2.3 TCONTROL	23
2.3 Heatsink Design Considerations	24
2.3.1 Heatsink Size	25
2.3.2 Heatsink Mass	25
2.3.3 Package IHS Flatness	26
2.3.4 Thermal Interface Material	26
2.4 System Thermal Solution Considerations	27
2.4.1 Chassis Thermal Design Capabilities	27
2.4.2 Improving Chassis Thermal Performance	27
2.4.3 Summary	28
2.5 System Integration Considerations	28
3 Thermal Metrology	29
3.1 Characterizing Cooling Performance Requirements	29
3.1.1 Example	31
3.2 Processor Thermal Solution Performance Assessment	31
3.3 Local Ambient Temperature Measurement Guidelines	32
3.4 Processor Case Temperature Measurement Guidelines	34
4 Thermal Management Logic and Thermal Monitor Feature	35
4.1 Processor Power Dissipation	35
4.2 Thermal Monitor Implementation	35
4.2.1 PROCHOT# Signal	36
4.2.2 Thermal Control Circuit	36
4.2.2.1 Thermal Monitor	36
4.2.2.2 Thermal Monitor 2 (TM2)	37
4.2.3 Operation and Configuration	38
4.2.4 On-Demand Mode	39
4.2.5 System Considerations	39
4.2.6 Operating System and Application Software Considerations	40
4.2.7 THERMTRIP# Signal	40
4.2.8 Cooling System Failure Warning	40
4.2.9 Digital Thermal Sensor	41
4.2.10 Platform Environmental Control Interface (PECI)	42
5 Intel® Thermal/Mechanical Reference Design Information	43
5.1 ATX Reference Design Requirements	43
5.2 Validation Results for Reference Design	45
5.2.1 Heatsink Performance	45
5.2.2 Acoustics	46
5.2.3 Altitude	47
5.2.4 Reference Heatsink Thermal Validation	47
5.2.5 Fan Performance for Active Heatsink Thermal Solution	48
5.3 Environmental Reliability Testing	49
5.3.1 Structural Reliability Testing	49
5.3.1.1 Random Vibration Test Procedure	49
5.3.1.2 Shock Test Procedure	49
5.3.2 Power Cycling	51
5.3.3 Recommended BIOS/Processor/Memory Test Procedures	51
5.4 Material and Recycling Requirements	51
5.5 Safety Requirements	52
5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	52
5.7 Reference Attach Mechanism	53
5.7.1 Structural Design Strategy	53
5.7.2 Mechanical Interface to the Reference Attach Mechanism	54
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration and Tuning	62

Intel Q9400S Design Guidelines - Page 52

Safety Requirements, Geometric Envelope for Intel, Reference ATX, Thermal Mechanical Design

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