Intel Q9400S Design Guidelines - Page 95
Filling Groove with Adhesive, Application of Accelerant, Removing
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Case Temperature Reference Metrology Figure 51. Filling Groove with Adhesive 32. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive and let it set for a couple of minutes (see Figure 52). Figure 52. Application of Accelerant Figure 53. Removing Excess Adhesive from IHS Thermal and Mechanical Design Guidelines 95
Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
95
Figure 51. Filling Groove with Adhesive
32.
To speed up the curing process apply Loctite* Accelerator on top of the Adhesive
and let it set for a couple of minutes (see Figure 52).
Figure 52. Application of Accelerant
Figure 53. Removing Excess Adhesive from IHS