Intel Q9400S Design Guidelines - Page 77
Appendix D, Case Temperature, Reference Metrology
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Case Temperature Reference Metrology Appendix D Case Temperature Reference Metrology D.1 D.2 Objective and Scope This appendix defines a reference procedure for attaching a thermocouple to the IHS of a 775-land LGA package for TC measurement. This procedure takes into account the specific features of the 775-land LGA package and of the LGA775 socket for which it is intended. The recommended equipment for the reference thermocouple installation, including tools and part numbers are also provided. In addition a video Thermocouple Attach Using Solder - Video CD-ROM is available that shows the process in real time. Supporting Test Equipment To apply the reference thermocouple attach procedure, it is recommended to use the equipment (or equivalent) given in the following table. Item Microscope DMM Thermal Meter Heater Block Heater Transformer Solder Flux Loctite* 498 Adhesive Adhesive Accelerator Kapton* Tape Thermocouple Description Part Number Measurement and Output Olympus* Light microscope or equivalent SZ-40 Digital Multi Meter for resistance measurement Fluke 79 Series Hand held thermocouple meter Multiple Vendors Solder Station (see note 1 for ordering information) Heater assembly to reflow solder on IHS WATLOW120V 150W Firerod Superior Powerstat transformer Miscellaneous Hardware 30330 0212G G1A38L12 05F857 Indium Corp. of America Alloy 57BI / 42SN / 1AG 0.010 Diameter Indium Corp. of America Super glue w/thermal characteristics 52124 5RMA 49850 Loctite* 7452 for fast glue curing 18490 For holding thermocouple in place Omega *,36 gauge, "T" Type (see note 2 for ordering information) Not Available OSK2K1280/5SR TC-TT-T-36-72 Thermal and Mechanical Design Guidelines 77