Intel Q9400S Design Guidelines - Page 90
D.5.3, Solder Process
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Case Temperature Reference Metrology 16. Place the two pieces of solder in parallel, directly over the thermocouple bead (see Figure 44) Figure 44. Positioning Solder on IHS D.5.3 17. Measure the resistance from the thermocouple end wires again using the DMM (refer to Section D.5.1.step 2) to ensure the bead is still properly contacting the IHS. Solder Process 18. Make sure the thermocouple that monitors the Solder Block temperature is positioned on the Heater block. Connect the thermocouple to a handheld meter to monitor the heater block temperature 19. Verify the temperature of the Heater block station has reached 155 °C ±5 °C before you proceed. 20. Connect the thermocouple for the device being soldered to a second hand held meter to monitor IHS temperature during the solder process. 90 Thermal and Mechanical Design Guidelines