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Intel Q9400S Design Guidelines - Page 119

Intel, RCFH4 Reference Solution Assembly -

UPC - 735858207973

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Mechanical Drawings Figure 73. Intel® RCFH4 Reference Solution Assembly - Page 2 2 ASSEMBLY/INSTALLATION PROCESS RECOMMENDATIONS 1 FAN ATTACH INSTALLATION: INSERT FAN ATTACH (1) INTO HEAT SINK (4) TO THE SPECIFIED DEPTH AND ORIENTATION. A A INSERT TOOL TO KEY TO TOP OF HEAT SINK FOR DEPTH ACCURACY. ARBOR PRESS OR SIMILAR TOOL IS REQUIRED. 2 FAN AND FAN WIRE INSTALLATION: A. THREAD WIRES THROUGH FIN GAP ON HEAT SINK FINS (4) AND POSITION THEM FLAT ACROSS POCKET CUT AND DOWN SPACE WHERE HALF LENGTH FIN IS. B. LOWER THE FAN (2) WHILE THREADING WIRES THROUGH THE HEAT SINK (4). C. TO SNAP FAN INTO THE HEAT SINK APPLY APPROXIMATELLY 14 N (3.2 LBF) OF FORCE WITH THE TOOL THAT INTERFACES WITH FAN STATOR THROUGH THE THREE HOLES ON THE FAN IMPELLER. NOTE: PRESSING DIRECTLY ON THE FAN IMPELLER MAY CAUSE DAMAGE TO INTERNAL FAN COMPONENTS. 3 INSERT FANGUARD (3) TO 2 ADJACENT CUTS ON HEAT ( 9.53 ) [ .375 ] SEE DETAIL B SINK AND SIMUTANIOUSLY SPREAD REMAINING FANGUARD LEGS TO CLEAR FAN AND EXTRUSION AND ROTATE GUARD TO ENGUAGE REMAINING CUTS IN HEATSINK. 4 CRITICAL TO FUNCTION. 2 SECTION A-A 9.53 0.12 [ .375 .004 ] 1 4 ( 5.88 ) [ .232 ] 3 DETAIL B SCALE 6 3 3 DEPARTMENT - R 2200 MISSION COLLEGE BLVD. CORP. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 SIZE DRAWING NUMBER A1 C88300 SCALE: 1 DO NOT SCALE DRAWING REV A SHEET 2 OF 2 Thermal and Mechanical Design Guidelines 119

Section	Page
1 Introduction	11
1.1 Document Goals and Scope	11
1.1.1 Importance of Thermal Management	11
1.1.2 Document Goals	11
1.1.3 Document Scope	12
1.2 References	13
1.3 Definition of Terms	14
2 Processor Thermal/Mechanical Information	17
2.1 Mechanical Requirements	17
2.1.1 Processor Package	17
2.1.2 Heatsink Attach	19
2.1.2.1 General Guidelines	19
2.1.2.2 Heatsink Clip Load Requirement	19
2.1.2.3 Additional Guidelines	20
2.2 Thermal Requirements	20
2.2.1 Processor Case Temperature	20
2.2.2 Thermal Profile	21
2.2.3 TCONTROL	23
2.3 Heatsink Design Considerations	24
2.3.1 Heatsink Size	25
2.3.2 Heatsink Mass	25
2.3.3 Package IHS Flatness	26
2.3.4 Thermal Interface Material	26
2.4 System Thermal Solution Considerations	27
2.4.1 Chassis Thermal Design Capabilities	27
2.4.2 Improving Chassis Thermal Performance	27
2.4.3 Summary	28
2.5 System Integration Considerations	28
3 Thermal Metrology	29
3.1 Characterizing Cooling Performance Requirements	29
3.1.1 Example	31
3.2 Processor Thermal Solution Performance Assessment	31
3.3 Local Ambient Temperature Measurement Guidelines	32
3.4 Processor Case Temperature Measurement Guidelines	34
4 Thermal Management Logic and Thermal Monitor Feature	35
4.1 Processor Power Dissipation	35
4.2 Thermal Monitor Implementation	35
4.2.1 PROCHOT# Signal	36
4.2.2 Thermal Control Circuit	36
4.2.2.1 Thermal Monitor	36
4.2.2.2 Thermal Monitor 2 (TM2)	37
4.2.3 Operation and Configuration	38
4.2.4 On-Demand Mode	39
4.2.5 System Considerations	39
4.2.6 Operating System and Application Software Considerations	40
4.2.7 THERMTRIP# Signal	40
4.2.8 Cooling System Failure Warning	40
4.2.9 Digital Thermal Sensor	41
4.2.10 Platform Environmental Control Interface (PECI)	42
5 Intel® Thermal/Mechanical Reference Design Information	43
5.1 ATX Reference Design Requirements	43
5.2 Validation Results for Reference Design	45
5.2.1 Heatsink Performance	45
5.2.2 Acoustics	46
5.2.3 Altitude	47
5.2.4 Reference Heatsink Thermal Validation	47
5.2.5 Fan Performance for Active Heatsink Thermal Solution	48
5.3 Environmental Reliability Testing	49
5.3.1 Structural Reliability Testing	49
5.3.1.1 Random Vibration Test Procedure	49
5.3.1.2 Shock Test Procedure	49
5.3.2 Power Cycling	51
5.3.3 Recommended BIOS/Processor/Memory Test Procedures	51
5.4 Material and Recycling Requirements	51
5.5 Safety Requirements	52
5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	52
5.7 Reference Attach Mechanism	53
5.7.1 Structural Design Strategy	53
5.7.2 Mechanical Interface to the Reference Attach Mechanism	54
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration and Tuning	62