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Intel, RCFH4 Reference Solution Assembly

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Figure 72. Intel® RCFH4 Reference Solution Assembly ( 95 ) [ 3.740 ] ( 90 ) [ 3.543 ] ( 120 ) [ 4.7 ] ( 65.42 ) [ 2.576 ] ( 62.9 ) [ 2.476 ] NOTES: 1. FOR DETAILED SPECIFICATIONS SEE COMPONENT DRAWINGS. 2. THERMAL INTERFACE MATERIAL: 0.2CC (0.4 GRAMS) SHIN-ETSU-MICRO-S1 G751 THERMAL GREASE. 3. SEE SHEET 2 FOR ASSEMBLY RECOMMENDATIONS. 4. US PATENTS PENDING. 118 Mechanical Drawings 2 3 1 4 14 13 12 11 TOP QTY ITEM NO C88298-001 C88297-001 C87023-001 C36448-001 C88300-001 PART NUMBER UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MILLIMETERS ALL UNTOLERANCED LINEAR DIMENSIONS ± 0 ANGLES ± 0.5 THIRD ANGLE PROJECTION RCH4,HS,CLIP,CORE,FASTENERS RCH4,FAN ASSEMBLY RCFH4,GUARD,WIRE PRESCOTT FMB2 FAN ATTACH RCFH4,MAIN ASSEMBLY DESCRIPTION DESIGNED BY DRAWN BY CHECKED BY APPROVED BY MATERIAL SEE NOTES PARTS LIST DATE 09/21/04 DATE 09/21/04 DATE 09/23/04 09/23/04 DATE 09/23/04 FINISH SEE NOTES DEPARTMENT TMD TITLE R 2200 MISSION COLLEGE BLVD. CORP. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 RCFH4, MAIN ASSEMBLY SIZE DRAWING NUMBER A1 C88300 SCALE: 1 DO NOT SCALE DRAWING REV A SHEET 1 OF 2 Thermal and Mechanical Design Guidelines

Section	Page
1 Introduction	11
1.1 Document Goals and Scope	11
1.1.1 Importance of Thermal Management	11
1.1.2 Document Goals	11
1.1.3 Document Scope	12
1.2 References	13
1.3 Definition of Terms	14
2 Processor Thermal/Mechanical Information	17
2.1 Mechanical Requirements	17
2.1.1 Processor Package	17
2.1.2 Heatsink Attach	19
2.1.2.1 General Guidelines	19
2.1.2.2 Heatsink Clip Load Requirement	19
2.1.2.3 Additional Guidelines	20
2.2 Thermal Requirements	20
2.2.1 Processor Case Temperature	20
2.2.2 Thermal Profile	21
2.2.3 TCONTROL	23
2.3 Heatsink Design Considerations	24
2.3.1 Heatsink Size	25
2.3.2 Heatsink Mass	25
2.3.3 Package IHS Flatness	26
2.3.4 Thermal Interface Material	26
2.4 System Thermal Solution Considerations	27
2.4.1 Chassis Thermal Design Capabilities	27
2.4.2 Improving Chassis Thermal Performance	27
2.4.3 Summary	28
2.5 System Integration Considerations	28
3 Thermal Metrology	29
3.1 Characterizing Cooling Performance Requirements	29
3.1.1 Example	31
3.2 Processor Thermal Solution Performance Assessment	31
3.3 Local Ambient Temperature Measurement Guidelines	32
3.4 Processor Case Temperature Measurement Guidelines	34
4 Thermal Management Logic and Thermal Monitor Feature	35
4.1 Processor Power Dissipation	35
4.2 Thermal Monitor Implementation	35
4.2.1 PROCHOT# Signal	36
4.2.2 Thermal Control Circuit	36
4.2.2.1 Thermal Monitor	36
4.2.2.2 Thermal Monitor 2 (TM2)	37
4.2.3 Operation and Configuration	38
4.2.4 On-Demand Mode	39
4.2.5 System Considerations	39
4.2.6 Operating System and Application Software Considerations	40
4.2.7 THERMTRIP# Signal	40
4.2.8 Cooling System Failure Warning	40
4.2.9 Digital Thermal Sensor	41
4.2.10 Platform Environmental Control Interface (PECI)	42
5 Intel® Thermal/Mechanical Reference Design Information	43
5.1 ATX Reference Design Requirements	43
5.2 Validation Results for Reference Design	45
5.2.1 Heatsink Performance	45
5.2.2 Acoustics	46
5.2.3 Altitude	47
5.2.4 Reference Heatsink Thermal Validation	47
5.2.5 Fan Performance for Active Heatsink Thermal Solution	48
5.3 Environmental Reliability Testing	49
5.3.1 Structural Reliability Testing	49
5.3.1.1 Random Vibration Test Procedure	49
5.3.1.2 Shock Test Procedure	49
5.3.2 Power Cycling	51
5.3.3 Recommended BIOS/Processor/Memory Test Procedures	51
5.4 Material and Recycling Requirements	51
5.5 Safety Requirements	52
5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	52
5.7 Reference Attach Mechanism	53
5.7.1 Structural Design Strategy	53
5.7.2 Mechanical Interface to the Reference Attach Mechanism	54
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration and Tuning	62

Match case Limit results 1 per page

Mechanical Drawings

118

Thermal and Mechanical Design Guidelines

Figure 72. Intel

RCFH4 Reference Solution Assembly

(

)

120

4.7

[

]

(

)

3.740

[

]

(

)

3.543

[

]

(

)

65.42

2.576

[

]

(

)

62.9

2.476

[

]

DEPARTMENT

CORP.

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

TMD

TITLE

RCFH4, MAIN ASSEMBLY

SIZE

DRAWING NUMBER

REV

C88300

SCALE:

DO NOT SCALE DRAWING

SHEET

SEE NOTES

FINISH

MATERIAL

09/23/04

DATE

APPROVED BY

09/23/04

DATE

CHECKED BY

09/21/04

DATE

DRAWN BY

09/21/04

DATE

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

IN ACCORDANCE WITH ASME Y14.5M-1994

DIMENSIONS ARE IN MILLIMETERS

ALL UNTOLERANCED LINEAR

DIMENSIONS ±

ANGLES ±

0.5

THIRD ANGLE PROJECTION

PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

RCFH4,MAIN ASSEMBLY

C88300-001

TOP

PRESCOTT FMB2 FAN ATTACH

C36448-001

RCFH4,GUARD,WIRE

C87023-001

RCH4,FAN ASSEMBLY

C88297-001

RCH4,HS,CLIP,CORE,FASTENERS

C88298-001

NOTES:

1. FOR DETAILED SPECIFICATIONS SEE COMPONENT DRAWINGS.

2. THERMAL INTERFACE MATERIAL: 0.2CC (0.4 GRAMS) SHIN-ETSU-MICRO-S1

G751 THERMAL GREASE.

3. SEE SHEET 2 FOR ASSEMBLY RECOMMENDATIONS.

4. US PATENTS PENDING.