Intel Q9400S Design Guidelines - Page 4

Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel - test

Page 4 highlights

5 6 Appendix A Appendix B 4.2.5 4.2.6 4.2.7 4.2.8 4.2.9 4.2.10 System Considerations 39 Operating System and Application Software Considerations ...........40 THERMTRIP# Signal 40 Cooling System Failure Warning 40 Digital Thermal Sensor 41 Platform Environmental Control Interface (PECI 42 Intel® Thermal/Mechanical Reference Design Information 43 5.1 ATX Reference Design Requirements 43 5.2 Validation Results for Reference Design 45 5.2.1 5.2.2 5.2.3 5.2.4 5.2.5 Heatsink Performance 45 Acoustics 46 Altitude 47 Reference Heatsink Thermal Validation 47 Fan Performance for Active Heatsink Thermal Solution 48 5.3 Environmental Reliability Testing 49 5.3.1 5.3.2 5.3.3 Structural Reliability Testing 49 5.3.1.1 Random Vibration Test Procedure 49 5.3.1.2 Shock Test Procedure 49 5.3.1.2.1 Recommended Test Sequence 50 5.3.1.2.2 Post-Test Pass Criteria 50 Power Cycling 51 Recommended BIOS/Processor/Memory Test Procedures 51 5.4 Material and Recycling Requirements 51 5.5 Safety Requirements 52 5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design ....52 5.7 Reference Attach Mechanism 53 5.7.1 5.7.2 Structural Design Strategy 53 Mechanical Interface to the Reference Attach Mechanism 54 Intel® Quiet System Technology (Intel® QST 57 6.1 Intel® Quiet System Technology Algorithm 57 6.1.1 Output Weighting Matrix 58 6.1.2 Proportional-Integral-Derivative (PID 58 6.2 Board and System Implementation of Intel® Quiet System Technology .......60 6.3 Intel® QST Configuration and Tuning 62 6.4 Fan Hub Thermistor and Intel® QST 62 LGA775 Socket Heatsink Loading 63 A.1 LGA775 Socket Heatsink Considerations 63 A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design 63 A.2.1 Heatsink Preload Requirement Limitations 63 A.2.2 Motherboard Deflection Metric Definition 64 A.2.3 Board Deflection Limits 65 A.2.4 Board Deflection Metric Implementation Example 66 A.2.5 Additional Considerations 67 A.2.5.1 Motherboard Stiffening Considerations 68 A.3 Heatsink Selection Guidelines 68 Heatsink Clip Load Metrology 69 B.1 Overview 69 4 Thermal and Mechanical Design Guidelines

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4
Thermal and Mechanical Design Guidelines
4.2.5
System Considerations
.............................................................
39
4.2.6
Operating System and Application Software Considerations
...........
40
4.2.7
THERMTRIP# Signal
.................................................................
40
4.2.8
Cooling System Failure Warning
................................................
40
4.2.9
Digital Thermal Sensor
.............................................................
41
4.2.10
Platform Environmental Control Interface (PECI)
..........................
42
5
Intel
®
Thermal/Mechanical Reference Design Information
.....................................
43
5.1
ATX Reference Design Requirements
.......................................................
43
5.2
Validation Results for Reference Design
...................................................
45
5.2.1
Heatsink Performance
..............................................................
45
5.2.2
Acoustics
...............................................................................
46
5.2.3
Altitude
..................................................................................
47
5.2.4
Reference Heatsink Thermal Validation
.......................................
47
5.2.5
Fan Performance for Active Heatsink Thermal Solution
..................
48
5.3
Environmental Reliability Testing
............................................................
49
5.3.1
Structural Reliability Testing
.....................................................
49
5.3.1.1
Random Vibration Test Procedure
................................
49
5.3.1.2
Shock Test Procedure
................................................
49
5.3.1.2.1
Recommended Test Sequence
...............................
50
5.3.1.2.2
Post-Test Pass Criteria
.............................................
50
5.3.2
Power Cycling
.........................................................................
51
5.3.3
Recommended BIOS/Processor/Memory Test Procedures
..............
51
5.4
Material and Recycling Requirements
......................................................
51
5.5
Safety Requirements
............................................................................
52
5.6
Geometric Envelope for Intel
®
Reference ATX Thermal Mechanical Design
....
52
5.7
Reference Attach Mechanism
..................................................................
53
5.7.1
Structural Design Strategy
........................................................
53
5.7.2
Mechanical Interface to the Reference Attach Mechanism
..............
54
6
Intel
®
Quiet System Technology (Intel
®
QST)
.....................................................
57
6.1
Intel
®
Quiet System Technology Algorithm
...............................................
57
6.1.1
Output Weighting Matrix
..........................................................
58
6.1.2
Proportional-Integral-Derivative (PID)
........................................
58
6.2
Board and System Implementation of
Intel
®
Quiet System Technology
.......
60
6.3
Intel
®
QST Configuration and Tuning
.......................................................
62
6.4
Fan Hub Thermistor and Intel
®
QST
........................................................
62
Appendix A
LGA775 Socket Heatsink Loading
......................................................................
63
A.1
LGA775 Socket Heatsink Considerations
..................................................
63
A.2
Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel
®
Reference Design
.................................................................................
63
A.2.1
Heatsink Preload Requirement Limitations
...................................
63
A.2.2
Motherboard Deflection Metric Definition
.....................................
64
A.2.3
Board Deflection Limits
............................................................
65
A.2.4
Board Deflection Metric Implementation Example
.........................
66
A.2.5
Additional Considerations
.........................................................
67
A.2.5.1
Motherboard Stiffening Considerations
.........................
68
A.3
Heatsink Selection Guidelines
.................................................................
68
Appendix B
Heatsink Clip Load Metrology
............................................................................
69
B.1
Overview
............................................................................................
69