Intel Q9400S Design Guidelines - Page 4
Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel - test
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5 6 Appendix A Appendix B 4.2.5 4.2.6 4.2.7 4.2.8 4.2.9 4.2.10 System Considerations 39 Operating System and Application Software Considerations ...........40 THERMTRIP# Signal 40 Cooling System Failure Warning 40 Digital Thermal Sensor 41 Platform Environmental Control Interface (PECI 42 Intel® Thermal/Mechanical Reference Design Information 43 5.1 ATX Reference Design Requirements 43 5.2 Validation Results for Reference Design 45 5.2.1 5.2.2 5.2.3 5.2.4 5.2.5 Heatsink Performance 45 Acoustics 46 Altitude 47 Reference Heatsink Thermal Validation 47 Fan Performance for Active Heatsink Thermal Solution 48 5.3 Environmental Reliability Testing 49 5.3.1 5.3.2 5.3.3 Structural Reliability Testing 49 5.3.1.1 Random Vibration Test Procedure 49 5.3.1.2 Shock Test Procedure 49 5.3.1.2.1 Recommended Test Sequence 50 5.3.1.2.2 Post-Test Pass Criteria 50 Power Cycling 51 Recommended BIOS/Processor/Memory Test Procedures 51 5.4 Material and Recycling Requirements 51 5.5 Safety Requirements 52 5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design ....52 5.7 Reference Attach Mechanism 53 5.7.1 5.7.2 Structural Design Strategy 53 Mechanical Interface to the Reference Attach Mechanism 54 Intel® Quiet System Technology (Intel® QST 57 6.1 Intel® Quiet System Technology Algorithm 57 6.1.1 Output Weighting Matrix 58 6.1.2 Proportional-Integral-Derivative (PID 58 6.2 Board and System Implementation of Intel® Quiet System Technology .......60 6.3 Intel® QST Configuration and Tuning 62 6.4 Fan Hub Thermistor and Intel® QST 62 LGA775 Socket Heatsink Loading 63 A.1 LGA775 Socket Heatsink Considerations 63 A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design 63 A.2.1 Heatsink Preload Requirement Limitations 63 A.2.2 Motherboard Deflection Metric Definition 64 A.2.3 Board Deflection Limits 65 A.2.4 Board Deflection Metric Implementation Example 66 A.2.5 Additional Considerations 67 A.2.5.1 Motherboard Stiffening Considerations 68 A.3 Heatsink Selection Guidelines 68 Heatsink Clip Load Metrology 69 B.1 Overview 69 4 Thermal and Mechanical Design Guidelines