Intel Q9400S Design Guidelines - Page 123

Intel® Enabled Reference Solution Information

Thermal and Mechanical Design Guidelines

123

Appendix G

Intel

®

Enabled Reference

Solution Information

This appendix includes supplier information for Intel enabled vendors for RCFH-4

reference design, D60188-001 reference design and BTX reference design.

The reference component designs are available for adoption by suppliers and heatsink

integrators pending completion of appropriate licensing contracts. For more

information on licensing, contact the Intel representative mentioned in Table 10.

Table 10. Intel

®

Representative Contact for Licensing Information of RCFH-4 and BTX

Company

Contact

Phone

Email

Intel Corporation

Tony De Leon

(253) 371-9339

[email protected]

The following tables list suppliers that produce Intel enabled reference components.

The part numbers listed below identifies these reference components. End-users are

responsible for the verification of the Intel enabled component offerings with the

supplier. OEMs and System Integrators are responsible for thermal, mechanical, and

environmental validation of these solutions.

Table 11. RCFH-4 Reference Thermal Solution Providers

Supplier

Part

Description

Part Number

Contact

Phone

Email

CCI*

(Chaun-Choung

Technology

Corp.)

Intel

®

RCFH-4

Reference

Heatsink

00I830901A

Harry Lin

Monica Chih

714-739-5797

+886-2-29952666

Extension 131

[email protected]

monica_chih@c

cic.

com.tw

AVC*

(ASIA Vital

Components

Co., Ltd)

Intel

®

RCFH-4

Reference

Heatsink

Z9U703K001

David Chao

+886-2-22996930

Extension: 619

[email protected]

om.tw

Sunon*

RCFH-4 Fan

Assembly

PMD1209PKB1-

A.(2).S.B1379.

F

Tom

Blaskovich

714-255-0208

extension 206

[email protected]

ITW Fastex*

Fastener

Base: C33389

Cap: C33390

Ron Schmidt

847-299-2222

rschmidt@itwfa

stex.com

Note:

These vendors and devices are listed by Intel as a convenience to Intel's general

customer base, but Intel does not make any representations or warranties whatsoever

regarding quality, reliability, functionality, or compatibility of these devices. This list

and/or these devices may be subject to change without notice.

Section	Page
1 Introduction	11
1.1 Document Goals and Scope	11
1.1.1 Importance of Thermal Management	11
1.1.2 Document Goals	11
1.1.3 Document Scope	12
1.2 References	13
1.3 Definition of Terms	14
2 Processor Thermal/Mechanical Information	17
2.1 Mechanical Requirements	17
2.1.1 Processor Package	17
2.1.2 Heatsink Attach	19
2.1.2.1 General Guidelines	19
2.1.2.2 Heatsink Clip Load Requirement	19
2.1.2.3 Additional Guidelines	20
2.2 Thermal Requirements	20
2.2.1 Processor Case Temperature	20
2.2.2 Thermal Profile	21
2.2.3 TCONTROL	23
2.3 Heatsink Design Considerations	24
2.3.1 Heatsink Size	25
2.3.2 Heatsink Mass	25
2.3.3 Package IHS Flatness	26
2.3.4 Thermal Interface Material	26
2.4 System Thermal Solution Considerations	27
2.4.1 Chassis Thermal Design Capabilities	27
2.4.2 Improving Chassis Thermal Performance	27
2.4.3 Summary	28
2.5 System Integration Considerations	28
3 Thermal Metrology	29
3.1 Characterizing Cooling Performance Requirements	29
3.1.1 Example	31
3.2 Processor Thermal Solution Performance Assessment	31
3.3 Local Ambient Temperature Measurement Guidelines	32
3.4 Processor Case Temperature Measurement Guidelines	34
4 Thermal Management Logic and Thermal Monitor Feature	35
4.1 Processor Power Dissipation	35
4.2 Thermal Monitor Implementation	35
4.2.1 PROCHOT# Signal	36
4.2.2 Thermal Control Circuit	36
4.2.2.1 Thermal Monitor	36
4.2.2.2 Thermal Monitor 2 (TM2)	37
4.2.3 Operation and Configuration	38
4.2.4 On-Demand Mode	39
4.2.5 System Considerations	39
4.2.6 Operating System and Application Software Considerations	40
4.2.7 THERMTRIP# Signal	40
4.2.8 Cooling System Failure Warning	40
4.2.9 Digital Thermal Sensor	41
4.2.10 Platform Environmental Control Interface (PECI)	42
5 Intel® Thermal/Mechanical Reference Design Information	43
5.1 ATX Reference Design Requirements	43
5.2 Validation Results for Reference Design	45
5.2.1 Heatsink Performance	45
5.2.2 Acoustics	46
5.2.3 Altitude	47
5.2.4 Reference Heatsink Thermal Validation	47
5.2.5 Fan Performance for Active Heatsink Thermal Solution	48
5.3 Environmental Reliability Testing	49
5.3.1 Structural Reliability Testing	49
5.3.1.1 Random Vibration Test Procedure	49
5.3.1.2 Shock Test Procedure	49
5.3.2 Power Cycling	51
5.3.3 Recommended BIOS/Processor/Memory Test Procedures	51
5.4 Material and Recycling Requirements	51
5.5 Safety Requirements	52
5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	52
5.7 Reference Attach Mechanism	53
5.7.1 Structural Design Strategy	53
5.7.2 Mechanical Interface to the Reference Attach Mechanism	54
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration and Tuning	62

Intel Q9400S Design Guidelines - Page 123

Appendix G, Intel, Enabled Reference, Solution Information

Page 123 highlights